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Polyurethane pouring sealant and preparation method thereof

A technology of potting glue and polyurethane, which is applied in the field of polyurethane materials, can solve the problems of difficult peeling and unsatisfactory low-temperature curing speed, and achieve the effects of fast low-temperature curing speed, good flame retardancy, and easy control of conditions

Pending Publication Date: 2021-12-31
DONGGUAN HONGDA POLYUREFHANE RESIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The epoxy potting glue used in the past has the disadvantages of being brittle and not easy to peel off, and the low-temperature curing speed is not ideal

Method used

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  • Polyurethane pouring sealant and preparation method thereof

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preparation example Construction

[0023] A preparation method of polyurethane potting glue, comprising the steps of:

[0024] S1. Preparation of component A: vacuum dehydrate polytetrahydrofuran ether diol and polyether polyol at 125°C-150°C, lower the temperature below 45°C, add flame retardant, flame retardant diluent and adhesion promoter, and pack with nitrogen gas , get A component;

[0025] S2. Preparation of component B: vacuum dehydrate the hydroxyl polyol at 125°C-150°C, cool down to 60-75°C, add antioxidant, then add toluene diisocyanate and catalyst and react at 85-90°C for 2-6 hours , carry out nitrogen protection during the reaction process, analyze NCO to the end point, lower the temperature, add plasticizer and stir evenly to obtain component B;

[0026] S3. Preparation of polyurethane potting compound: mixing component A in step S1 and component B in step S2 to obtain a polyurethane potting compound.

[0027] Further, the raw material composition and weight ratio of the A component are: polye...

Embodiment 1

[0037] A preparation method of polyurethane potting glue, comprising the steps of:

[0038] S1. Preparation of component A: vacuum dehydrate polytetrahydrofuran ether diol and polyether polyol at 125°C, lower the temperature below 45°C, add inorganic phosphate, phosphite and epoxy silane coupling agent, and pack with nitrogen gas. Get A component;

[0039] S2. Preparation of component B: dehydrate pentaerythritol under vacuum at 125°C, cool down to 60°C, add antioxidant, then add toluene diisocyanate and dibutyltin dilaurate, react at 85°C for 2 hours, and carry out nitrogen protection during the reaction process , analyze NCO to the end point, lower the temperature, add plasticizer and stir evenly to obtain component B;

[0040] S3. Preparation of polyurethane potting compound: mixing component A in step S1 and component B in step S2 to obtain a polyurethane potting compound.

Embodiment 2

[0042] A preparation method of polyurethane potting glue, comprising the steps of:

[0043] S1. Preparation of component A: vacuum dehydrate polytetrahydrofuran ether diol and polyether polyol at 130°C, lower the temperature below 45°C, add phosphorus-nitrogen mixed intumescent flame retardant, phosphite and mercapto-based silane coupling agent , packed with nitrogen gas to obtain component A;

[0044] S2. Preparation of component B: vacuum dehydrate pentaerythritol and dipentaerythritol at 130°C, cool down to 65°C, add antioxidant, then add toluene diisocyanate and dibutyltin dilaurate to react at 90°C for 4 hours, and the reaction process proceeds Nitrogen protection, analyze NCO to the end point, lower the temperature, add plasticizer and stir evenly to obtain component B;

[0045] S3. Preparation of polyurethane potting compound: mixing component A in step S1 and component B in step S2 to obtain a polyurethane potting compound.

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Abstract

The invention relates to the field of polyurethane materials, in particular to a preparation method of a polyurethane pouring sealant, which comprises the following steps: preparing a component A; preparing the component B; and preparing the polyurethane pouring sealant: mixing the component A in the step S1 and the component B in the step S2 to obtain the polyurethane pouring sealant. The polyurethane pouring sealant provided by the invention has the characteristics of small viscosity, normal-temperature curing, and controllable curing speed and time, has excellent film performance, and also has good flexibility, water resistance, flame retardance and electrical performance, and can be applied to potting of electric appliance elements. The invention also provides a preparation method of the polyurethane pouring sealant. The preparation method is simple and rapid.

Description

technical field [0001] The invention relates to the field of polyurethane materials, in particular to a polyurethane potting glue and a preparation method thereof. Background technique [0002] Potting glue, also known as electronic glue, is used for bonding, sealing, potting and coating protection of electronic components; potting is an important field of polyurethane application; potting is to use liquid polyurethane compound mechanically or manually It is poured into devices equipped with electronic components and circuits, and cured under normal temperature or heating conditions to become a thermosetting polymer insulating material with excellent performance. Its function is to strengthen the integrity of electronic devices, improve the resistance to external shocks and vibrations; improve the insulation between internal components and lines, which is conducive to the miniaturization and lightweight of devices; avoid direct exposure of components and lines, and improve t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/76C08G18/66C08G18/48C08G18/32C09J175/08C09J11/04C09J11/06
CPCC08G18/7614C08G18/4854C08G18/4804C08G18/3206C08G18/6611C09J175/08C09J11/04C09J11/06C08K3/016C08K5/0066
Inventor 王瑞宏原素萍
Owner DONGGUAN HONGDA POLYUREFHANE RESIN
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