Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging

An epoxy adhesive, LED packaging technology, applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of fluorescence quenching, low quality, high flexibility, etc., achieve mild reaction conditions, and the preparation method Simple, excellent product performance effect

Pending Publication Date: 2021-12-31
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Common ideal fluorescent materials are organic dyes containing aromatic rings, which have the advantages of high emission efficiency, low mass, and high flexibility. By adjusting the size of the conjugated π-electro

Method used

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  • Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging
  • Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging
  • Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Example 1: At room temperature, formulate the components according to Example 1 in Table 1, mix bisphenol A epoxy resin with biphenyl anhydride and 2-anthracene carboxylic acid, and then grind it with a three-roll machine to become fine and uniform The mixture obtained was transferred to a three-necked flask, stirred and condensed in an oil bath at 170° C. for 2 h. After the liquid was taken out and refluxed, it was cooled to 25°C, polyetheramine D230 was added, and stirred under vacuum at 25°C to remove air bubbles, and the fluorescent powder-free recyclable epoxy adhesive of the embodiment of the present invention was prepared.

Embodiment 2

[0024] Embodiment 2: At normal temperature, formulate each component according to embodiment 2 in table 1, bisphenol A type epoxy resin is mixed with butenedioic anhydride and 2-anthracene carboxylic acid, become fine and smooth after three-roll machine grinding homogeneous mixture, the resulting fine and homogeneous mixture was transferred to a three-necked flask, stirred and condensed in an oil bath at 200°C for 1 h. After the reflux was taken out, the liquid was cooled to 40°C, 1,6-hexamethylenediamine was added, and stirred in a vacuum at 40°C to remove air bubbles, and the fluorescent powder-free recyclable epoxy adhesive of the embodiment of the present invention was prepared.

Embodiment 3

[0025] Embodiment 3: At normal temperature, formulate each component according to embodiment 3 in table 1, bisphenol F type epoxy resin and tetrahydrophthalic anhydride and 1,2,3,4-tetrahydro-1-naphthalene The formic acid was mixed, and after being ground by a three-roll machine, a fine and uniform mixture was obtained. The obtained fine and uniform mixture was transferred to a three-necked flask, stirred, condensed and refluxed in an oil bath at 160°C for 3 hours. After the reflux was taken out, the liquid was cooled to 30°C, polyetheramine D230 was added, and stirred under vacuum at 25°C to remove air bubbles, and the phosphor-free recyclable epoxy adhesive of the embodiment of the present invention was prepared.

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Abstract

The invention discloses a preparation method of a fluorescent powder-free recoverable epoxy adhesive for white light LED packaging, and belongs to the technical field of polymer material preparation. The epoxy adhesive is prepared from the following components in percentage by weight: 60%-90% of epoxy resin, 10%-40% of an amine curing agent and 0.01%-0.6% of anhydride/carboxylic acid. According to the preparation method, anhydride/carboxylic acid with high conjugation strength is introduced into epoxy resin, a conjugation effect is used, firstly a yellow light element is generated, and then an amine curing agent is added, so that clusters are formed in a network, blue light elements are generated, meanwhile, dynamic reversible covalent bond beta-hydroxy ester is generated, and by adjusting the ratio of the yellow light element to the blue light element, the chemically crosslinked and recoverable epoxy adhesive without an additional catalyst is prepared. The preparation method is simple, efficient, free of additional catalysts, environmentally friendly, low in toxicity while reducing the cost and especially suitable for the technical field of white light LED packaging simplification and the like.

Description

Technical field: [0001] The invention belongs to the technical field of polymer material preparation, and in particular relates to a preparation method of a fluorescent powder-free recyclable epoxy adhesive used for packaging white light LEDs. Background technique: [0002] The recyclable epoxy dynamic network is a three-dimensional network self-healing material containing dynamic reversible covalent bonds. The dynamic reversible covalent bond has both the high strength of the covalent bond and the reversible nature of the non-covalent bond. Reversible cleavage and combination occur, so thermodynamic equilibrium reactions can be carried out between molecules, and dynamic exchange and recombination of molecules can be realized. After the external field is removed, the covalent bond remains stable like the traditional irreversible covalent bond. The cross-linked high molecular polymer material containing dynamic reversible covalent bonds can be processed by thermoplastic proc...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/06C08G59/50
CPCC09J163/00C09J11/06C08G59/504C08G59/5006C08G2170/00C08K5/09C08K5/1539
Inventor 高宏王苗苗金玲夏友谊杨建国
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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