Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging

An epoxy adhesive, LED packaging technology, applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of fluorescence quenching, low quality, high flexibility, etc., achieve mild reaction conditions, and the preparation method Simple, excellent product performance effect

Pending Publication Date: 2021-12-31
ANHUI UNIVERSITY OF TECHNOLOGY
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Common ideal fluorescent materials are organic dyes containing aromatic rings, which have the advantages of high emission efficiency, low mass, and high flexibility. By adjusting the size of the conjugated π-electron system and changing the strength of spatial conjugation, you can obtain fluorescent materials from ultraviolet to near Emitting light waves at infrared wavelengths, but most of these materials are quenched by aggregation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging
  • Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging
  • Preparation method of fluorescent-powder-free recoverable epoxy adhesive for white-light LED (light-emitting diode) packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1: At room temperature, formulate the components according to Example 1 in Table 1, mix bisphenol A epoxy resin with biphenyl anhydride and 2-anthracene carboxylic acid, and then grind it with a three-roll machine to become fine and uniform The mixture obtained was transferred to a three-necked flask, stirred and condensed in an oil bath at 170° C. for 2 h. After the liquid was taken out and refluxed, it was cooled to 25°C, polyetheramine D230 was added, and stirred under vacuum at 25°C to remove air bubbles, and the fluorescent powder-free recyclable epoxy adhesive of the embodiment of the present invention was prepared.

Embodiment 2

[0024] Embodiment 2: At normal temperature, formulate each component according to embodiment 2 in table 1, bisphenol A type epoxy resin is mixed with butenedioic anhydride and 2-anthracene carboxylic acid, become fine and smooth after three-roll machine grinding homogeneous mixture, the resulting fine and homogeneous mixture was transferred to a three-necked flask, stirred and condensed in an oil bath at 200°C for 1 h. After the reflux was taken out, the liquid was cooled to 40°C, 1,6-hexamethylenediamine was added, and stirred in a vacuum at 40°C to remove air bubbles, and the fluorescent powder-free recyclable epoxy adhesive of the embodiment of the present invention was prepared.

Embodiment 3

[0025] Embodiment 3: At normal temperature, formulate each component according to embodiment 3 in table 1, bisphenol F type epoxy resin and tetrahydrophthalic anhydride and 1,2,3,4-tetrahydro-1-naphthalene The formic acid was mixed, and after being ground by a three-roll machine, a fine and uniform mixture was obtained. The obtained fine and uniform mixture was transferred to a three-necked flask, stirred, condensed and refluxed in an oil bath at 160°C for 3 hours. After the reflux was taken out, the liquid was cooled to 30°C, polyetheramine D230 was added, and stirred under vacuum at 25°C to remove air bubbles, and the phosphor-free recyclable epoxy adhesive of the embodiment of the present invention was prepared.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method of a fluorescent powder-free recoverable epoxy adhesive for white light LED packaging, and belongs to the technical field of polymer material preparation. The epoxy adhesive is prepared from the following components in percentage by weight: 60%-90% of epoxy resin, 10%-40% of an amine curing agent and 0.01%-0.6% of anhydride / carboxylic acid. According to the preparation method, anhydride / carboxylic acid with high conjugation strength is introduced into epoxy resin, a conjugation effect is used, firstly a yellow light element is generated, and then an amine curing agent is added, so that clusters are formed in a network, blue light elements are generated, meanwhile, dynamic reversible covalent bond beta-hydroxy ester is generated, and by adjusting the ratio of the yellow light element to the blue light element, the chemically crosslinked and recoverable epoxy adhesive without an additional catalyst is prepared. The preparation method is simple, efficient, free of additional catalysts, environmentally friendly, low in toxicity while reducing the cost and especially suitable for the technical field of white light LED packaging simplification and the like.

Description

Technical field: [0001] The invention belongs to the technical field of polymer material preparation, and in particular relates to a preparation method of a fluorescent powder-free recyclable epoxy adhesive used for packaging white light LEDs. Background technique: [0002] The recyclable epoxy dynamic network is a three-dimensional network self-healing material containing dynamic reversible covalent bonds. The dynamic reversible covalent bond has both the high strength of the covalent bond and the reversible nature of the non-covalent bond. Reversible cleavage and combination occur, so thermodynamic equilibrium reactions can be carried out between molecules, and dynamic exchange and recombination of molecules can be realized. After the external field is removed, the covalent bond remains stable like the traditional irreversible covalent bond. The cross-linked high molecular polymer material containing dynamic reversible covalent bonds can be processed by thermoplastic proc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/00C09J11/06C08G59/50
CPCC09J163/00C09J11/06C08G59/504C08G59/5006C08G2170/00C08K5/09C08K5/1539
Inventor 高宏王苗苗金玲夏友谊杨建国
Owner ANHUI UNIVERSITY OF TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com