Epoxy resin composite material for packaging power electronic transformer and preparation method of composite material

A technology of epoxy resin and composite materials, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of poor packaging stability and insufficient reliability of high-power power electronic transformers, and achieve the convenience of large-scale production and improved mechanics. Performance, simple operation effect

Pending Publication Date: 2022-01-04
HEFEI UNIV OF TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is: the packaging stability of the high-power power electronic transformer is poor, the reliability is insufficient, and the insulation performance and thermal conductivity need to be improved. It aims to provide a high breakdown strength, better insulation performance, thermal conductivity Strong epoxy resin composite material, and the preparation method is easy to operate

Method used

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  • Epoxy resin composite material for packaging power electronic transformer and preparation method of composite material

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Experimental program
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Effect test

Embodiment 1

[0032] The epoxy resin composite material in Example 1 is composed of epoxy resin, composite filler, curing agent, and accelerator, and the parts by mass are 100:250:80:1 in the aforementioned order. Wherein, the composite filler is configured by micro-diamond and nano-alumina, and its mass fraction is 4:1 according to the aforementioned sequence.

[0033] In Example 1, the particle size of the micro-diamond is 20 μm, and the particle size of the nano-alumina is 100 nm. The epoxy resin is bisphenol A type epoxy resin. The curing agent is methyl hexahydrophthalic anhydride. The accelerator is dimethylbenzylamine.

[0034] In embodiment 1, the preparation method of epoxy resin composite material comprises the following steps:

[0035] Step 1, mixing micro-diamond and nano-alumina to obtain a compound filler;

[0036] Step 2: Add the epoxy resin and the composite filler into the reaction kettle, and stir for 2 hours at 100° C. under a vacuum condition, and the stirring speed ...

Embodiment 2

[0043] The epoxy resin composite material in Example 2 is composed of epoxy resin, compound filler, curing agent and accelerator, and the parts by mass are 100:225:80:1 according to the aforementioned order. Wherein, the composite filler is configured by micro-diamond and nano-alumina, and the mass fraction thereof is 8:1 according to the aforementioned sequence.

[0044] In Example 2, the particle size of the micro-diamond is 20 μm, and the particle size of the nano-alumina is 100 nm. The epoxy resin is bisphenol A type epoxy resin. The curing agent is methyl hexahydrophthalic anhydride. The accelerator is dimethylbenzylamine.

[0045]In embodiment 2, the preparation method of the epoxy resin composite material is the same as that of embodiment 1. That is, an epoxy resin composite material in which the mass ratio of micro-diamond and nano-alumina is 8:1 is finally prepared.

Embodiment 3

[0047] The epoxy resin composite material in Example 3 is composed of epoxy resin, composite filler, curing agent, and accelerator, and the parts by mass are 100:216.7:80:1 according to the aforementioned order. Wherein, the composite filler is configured by micro-diamond and nano-alumina, and its mass fraction is 12:1 according to the aforementioned sequence.

[0048] In Example 3, the particle size of the micro-diamond is 20 μm, and the particle size of the nano-alumina is 100 nm. The epoxy resin is bisphenol A type epoxy resin. The curing agent is methyl hexahydrophthalic anhydride. The accelerator is dimethylbenzylamine.

[0049] The preparation method of the epoxy composite material in Example 3 is the same as that in Example 1. That is, an epoxy resin composite material with a mass ratio of micro-diamond to nano-alumina of 12:1 was finally prepared.

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Abstract

The invention discloses an epoxy resin composite material for packaging a power electronic transformer and a preparation method of the composite material, and belongs to the field of power electronic device packaging insulating materials. The epoxy resin composite material is a micron diamond / nano aluminum oxide blended epoxy composite material and is prepared from epoxy resin, compound filler, a curing agent and an accelerant, and the compound filler is prepared from micron diamond and nano aluminum oxide. The preparation method comprises the following steps: adding the compound filler into the epoxy resin matrix, stirring, adding the curing agent accelerator according to the ratio, slowly injecting into a mold, putting the mold into a vacuum oven for defoaming, and finally performing curing to form the epoxy resin composite material. The preparation method is simple and suitable for industrial production, the prepared epoxy composite material is excellent in electrical insulation performance and heat conduction performance, and the problem that high-power power electronic transformers are insufficient in packaging stability and reliability can be effectively solved.

Description

technical field [0001] The invention relates to the field of packaging insulating materials for power electronic devices, in particular to an epoxy resin composite material for packaging power electronic transformers and a preparation method thereof. Background technique [0002] With the continuous advancement of power electronic device technology, power electronic equipment will inevitably develop in the direction of high frequency, miniaturization, high voltage, and high current, and the output power density will continue to increase. Reliability puts forward higher requirements. With the substitution of silicon carbide (SiC) materials for silicon materials, compared with traditional silicon power devices, SiC power devices can withstand higher breakdown voltage, higher current and higher operating temperature, while their switching speed Faster with less switching loss. Power electronic transformers will develop towards faster switching speeds and higher operating volt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/04C08K3/22C09K5/14
CPCC08K3/04C08K3/22C09K5/14C08K2201/011C08K2003/2227C08L2203/206C08K2201/003C08L63/00
Inventor 赵玉顺施银军陈新张翀杨威陈赟王琨豆宏利邓先钦高凯
Owner HEFEI UNIV OF TECH
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