Chemical mechanical polishing cleaning solution and use method thereof

Abstract

The invention discloses a chemical mechanical polishing cleaning solution and a use method thereof. The cleaning solution comprises a complexing agent, a surfactant, a wetting agent, a pH regulator and the balance of water. The chemical mechanical polishing cleaning solution is a highly concentrated cleaning solution, and can simultaneously clean a wafer and a polishing pad after chemical mechanical polishing by adjusting the dilution ratio.

Description

technical field [0001] The invention relates to a cleaning solution, in particular to a cleaning solution for wafers and polishing pads after chemical mechanical polishing in semiconductor manufacturing. Background technique [0002] At present, the VLSI chip integration has reached billions of components, and the feature size has entered the nanometer level, which requires hundreds of processes in the microelectronics process, especially multi-layer wiring, substrates, media, etc. After chemical mechanical planarization. VLSI wiring is transforming from traditional aluminum wiring technology to copper wiring technology. Compared with Al, Cu wiring has the advantages of low resistivity, high electromobility resistance, and short RC delay time, which enables Cu wiring to replace Al as an interconnect metal in semiconductor manufacturing. However, there is no effective plasma etching or wet etching technology for copper to achieve planarization, and chemical mechanical polis...

AI Technical Summary

Problems solved by technology

Based on this, the current cleaning solution can only be used to clean one of the wafer or the polishing pad, and cannot satisfy the cleaning of the wafer and the polishing pad at the same time, so that the cleaning of the wafer and the polishing pad can be performed in two different ways. The cleaning liquid process is carried out, which increases the complexity of the cleaning process, reduces the efficiency of the cleaning work, and is not conducive to the improvement of production efficiency

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