Preparation method for mode field conversion coupling structure and preparation structure of the mode field conversion coupling structure

Abstract

The invention discloses a multilayer coupling structure for photon chip mode field conversion, the lower layer in the coupling structure is a conical structure, the upper layer is an optical waveguide structure with a large size, and a light beam transmitted in the lower layer conical structure is gradually transferred to the upper layer optical waveguide structure for transmission. High-efficiency light beam transmission between the photon chip and the optical fiber is achieved, and the advantages of being low in coupling loss and easy to prepare are achieved. The invention further discloses a structure preparation method based on the chemical mechanical polishing method. The structure preparation method has the advantages of being low in cost, high in machining efficiency, simple in process, high in yield and the like.

Description

technical field [0001] The invention relates to the field of preparation of coupling structures for mode field conversion, in particular to the field of multilayer coupling preparation for mode field conversion of photonic chips. Background technique [0002] Large-scale photonic integrated chips are the key devices to realize future optical quantum technology, high-speed optical communication and optical information processing technology. The cross-sectional size of the optical waveguide on the photonic chip is usually sub-micron, and such a small size provides the possibility for large-scale integration; but on the other hand, since modern optical transmission networks are built on optical fibers, the cross-sectional size of standard communication optical fibers is usually several microns . When the light wave is transmitted between the optical fiber and the optical waveguide of the photonic chip, the difference in the cross-sectional size of the two leads to extremely lo...

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Problems solved by technology

It has the advantages of high coupling efficiency and low wavelength sensitivity. However, due to its small structure size and extremely high requirements for structure processing accuracy, it is often necessary to use a preparation method with a line width that is much smaller than the characteristic size of the photonic chip waveguide. For example, such as Deep / extreme ultraviolet lithography, electron / ion beam direct writing and other methods are used for processing, which will greatly increase the process cost and reduce the production efficiency

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