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A kind of halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability and preparation method thereof

A storage stability, epoxy powder technology, used in powder coatings, epoxy resin coatings, coatings, etc., can solve the problems of low temperature curing, accumulation, environmental and human health hazards, and achieve excellent storage stability, Long shelf life, effect of increasing melt viscosity

Active Publication Date: 2022-04-26
天津凯华绝缘材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent publication still uses phosphorus-based flame retardants, which are essentially different from the non-phosphorous flame retardants used in the patent application of the present invention
[0014] 2. A highly flame-retardant and highly flexible epoxy resin composition and its preparation method (CN110156959A). The main technical means of this patent publication is to synthesize a highly flame-retardant curing agent with a heterocyclic structure. This curing agent It still contains phosphorus, and this kind of composition cannot achieve low-temperature curing at 100-120°C, which is quite different from the low-temperature halogen-free and phosphorus-free epoxy powder composition of the patent application of the present invention
OPFRs are generally semi-volatile, easily enter the environment and accumulate in organisms, causing potential harm to the environment and human health

Method used

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  • A kind of halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability and preparation method thereof
  • A kind of halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability and preparation method thereof
  • A kind of halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability and preparation method thereof

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Experimental program
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preparation example Construction

[0083] The preparation method of the halogen-free phosphorus-free low-temperature curing epoxy powder composition with storage stability as described above, the steps are as follows:

[0084] Pre-mix the other raw materials except for the thixotropic agent in a high-speed mixer with a speed of 500-1500rpm, and the mixing time is 5-15 minutes, and then add them to the twin-screw extruder, and set the temperature at 80 -110°C, melt the resin under the shearing state of the screw and mix it evenly with other raw materials. After the melt is cooled by the cooling roller, it enters the ACM mill to be crushed. After wind selection and sieving, the particles with the required particle size are collected. , and finally add an external thixotropic agent to make the powder fluidized and fluffy, that is, a halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability.

[0085] Specifically, the relevant preparation and detection are as follows: ...

Synthetic example 1

[0087] Synthesis Example 1: 1 part of carnauba wax and 3 parts of phenyldimethylurea were mixed evenly with a small high-speed mixer at a rotation speed of 500-1500 rpm, and the mixing time was 5-15 minutes. Then the mixture is melt-extruded with a twin-screw extruder, and the temperature of the extruder is set at 110°C. After being cooled by a cooling roller, it is pulverized with a pulverizer, and passed through a 100-mesh standard sieve to obtain wax powder coated and modified Phenyl dimethyl urea curing agent.

Synthetic example 2

[0088] Synthesis example 2: 1 part of carnauba wax and 3 parts of TDI dimethyl urea were mixed evenly with a small high-speed mixer at a speed of 500-1500 rpm and the mixing time was 5-15 minutes. Then the mixture is melt-extruded with a twin-screw extruder, and the temperature of the extruder is set at 110°C. After being cooled by a cooling roller, it is pulverized with a pulverizer, and passed through a 100-mesh standard sieve to obtain wax powder coated and modified TDI dimethyl urea curing agent.

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Abstract

The invention discloses a halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability. 2-10 parts of curing agent; 10-20 parts of filler; 25-45 parts of inorganic flame retardant; 5-15 parts of nitrogen-containing flame retardant; 5-15 parts of zinc stannate flame retardant; 1-5 parts of pigment; 0.5-2 parts of leveling agent; 0.2-3 parts of internal thixotropic agent; 0.2-1.0 parts of external thixotropic agent. The composition of the present invention uses a solid epoxy resin with a medium and low softening point as the main film-forming substance, and uses wax powder-coated and modified substituted urea substances as the curing agent, which has excellent storage stability at 40°C, making the coating more effective long storage period.

Description

technical field [0001] The invention belongs to the technical field of packaging materials for electronic components, in particular to a halogen-free and phosphorus-free low-temperature curing epoxy powder composition with storage stability and a preparation method thereof. Background technique [0002] Powder coating is a low-VOC solid coating, which is applied to the surface of the substrate by spraying or fluidized bed coating, and has the characteristics of green, environmental protection and high efficiency. When applied to heat-sensitive substrates (such as wood, plastic, rubber), because heat-sensitive substrates cannot withstand high temperatures, they need to be lower than 120°C when using fluidized bed coating methods for preheating and curing. The core of the film capacitor is a polypropylene or polyethylene film sprayed with metal powder on the surface, and the temperature resistance of this kind of electronic components is also below 120°C. Therefore, the prehe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D163/00C09D5/03C09D5/18C09D5/25C09D7/65C09D7/61C08G59/40
CPCC09D163/00C09D5/03C09D5/033C09D5/18C09D5/00C08G59/4021C08G59/4028C08K2003/2227C08K2003/2224C08L2201/22C08L2201/02C08L91/06C08L91/00C08K3/24C08K3/36C08K3/346C08K3/22
Inventor 周庆丰
Owner 天津凯华绝缘材料股份有限公司
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