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Steam generation for chemical mechanical polishing

A steam generator, steam technology, applied in the direction of steam generation, steam generation methods, grinding machine tools, etc., to achieve the effect of reducing defects, low liquid content, and reducing temperature changes

Pending Publication Date: 2022-02-08
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lower chamber is positioned to receive water from the water inlet
Steam outlet valve receives steam from upper chamber

Method used

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  • Steam generation for chemical mechanical polishing
  • Steam generation for chemical mechanical polishing
  • Steam generation for chemical mechanical polishing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Chemical mechanical polishing is performed by a combination of mechanical abrasion and chemical etching at the interface between the substrate, polishing solution, and polishing pad. During the polishing process, a large amount of heat is generated due to friction between the substrate surface and the polishing pad. Additionally, some processes also include an in-situ pad conditioning step in which a conditioning disk (eg, a disk coated with abrasive diamond particles) is pressed against a rotating polishing pad to condition and texture the surface of the polishing pad. The abrasion of the finishing process also generates heat. For example, in a typical one minute copper CMP process (with a nominal downforce of 2 psi and a removal rate of / min), the surface temperature of the polyurethane polishing pad may increase by about 30°C.

[0026] On the other hand, if the pad has been heated by a previous lapping operation, when the new substrate is initially lowered into co...

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PUM

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Abstract

A steam generating apparatus includes a canister having a water inlet and a steam outlet. The steam generating apparatus includes a barrier in the canister dividing the canister into a lower chamber and an upper chamber. The lower chamber is positioned to receive water from the water inlet. The steam outlet valve receives steam from the upper chamber. The barrier has apertures for steam to pass from the lower chamber to the upper chamber and allows for condensation to pass from the upper chamber to the lower chamber. The steam generating apparatus includes a heating element configured to apply heat to a portion of lower chamber. The steam generating apparatus includes a controller configured to modify the flow rate of water through the water inlet to keep a water level above the heating element and below the steam outlet.

Description

technical field [0001] The present disclosure relates to chemical mechanical polishing (CMP), and more particularly to the use of steam cleaning or preheating during CMP. Background technique [0002] Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconducting or insulating layers onto a semiconductor wafer. Various fabrication processes require planarization of layers on a substrate. For example, one fabrication step involves depositing a filler layer onto a non-planar surface and planarizing the filler layer. For some applications, the filler layer is planarized until the top surface of the patterned layer is exposed. For example, a metal layer may be deposited on the patterned insulating layer to fill trenches or holes in the insulating layer. After planarization, the remainder of the metal in the trenches and holes of the patterned layer forms vias, plugs, and lines to provide conductive paths between the thin film cir...

Claims

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Application Information

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IPC IPC(8): F22D5/26B08B1/00F22B1/28B08B3/10B08B13/00F22B37/46
CPCF22D5/26F22B1/285B08B3/106B08B13/00F22B37/46B08B2203/007B08B1/10B08B1/14B08B1/16B24B37/20B81C2201/0104B24B37/015B24B37/34F22B1/284
Inventor H·桑达拉拉贾恩张寿松吴昊晟P·D·巴特菲尔德唐建设C·波拉德
Owner APPLIED MATERIALS INC