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Honeycomb sandwich preparation method for improving honeycomb sandwich bonding force and honeycomb sandwich

A technology of honeycomb interlayer and adhesive force, which is applied in the field of honeycomb interlayer, can solve problems such as defects, low bonding efficiency, and glue spots at the bonding position, achieve high bonding strength and mechanical properties, avoid forming defects, and improve bonding quality high effect

Active Publication Date: 2022-03-01
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the structural characteristics of the honeycomb interlayer itself, the bonding between the core layer and the panel belongs to the edge bonding, and the bonding efficiency is low, especially in the co-curing process, because the viscosity of the resin contained in the panel prepreg is low during the curing process. point, under the action of gravity field, the uncontrollable loss of glue will cause the formation of glue spots at the bonding position, which will easily lead to obvious deterioration of bonding performance, and the loss of peel strength or flat tensile strength exceeds 50%.

Method used

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  • Honeycomb sandwich preparation method for improving honeycomb sandwich bonding force and honeycomb sandwich
  • Honeycomb sandwich preparation method for improving honeycomb sandwich bonding force and honeycomb sandwich
  • Honeycomb sandwich preparation method for improving honeycomb sandwich bonding force and honeycomb sandwich

Examples

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Effect test

Embodiment 1

[0062] A cyanate quartz fabric panel / aramid paper honeycomb sandwich article, the cross-sectional shape of the honeycomb unit is a positive hexagon, and the honeycomb core body is known to be 2.5-3.0MPa, using Xantu developed by New Zealand Revolution Fibres. The LAYR nanofiber membrane is used as a transferee organic soft fiber layer, and the hexa tool (while the six cutting tools) is used in accordance with the distribution cycle of the honeycomb unit, the processing is completed, and the laying order is sequentially panel prepared. / After the film / processed nanofiber membrane / honeycomb core / processed nanofiber membrane / film / panel prepreg, in the heat pressing tank, in 0.3 MPa pressure. After the curing is completed, it is processed into 60 * 60 standard test blocks and performs a flat pull strength test. The test results show that the pull-up intensity of the honeycomb interlayer prepared by the present preparation method is 2.3-2.9 MPa, and the destruction mode is...

Embodiment 2

[0067] A aluminum honeycomb sandwich article, the skin thickness is 1 mm, the core layer thickness is 7mm, and the mesh size is 3.2mm, the wall thickness is 0.1 mm as the core material, since the use ambient temperature is high, the cyanate film, It is known that the honeycomb core body body is 3.5-4.2 MPa, and a aramid melt-free nonwoven fabric having a surface density of 20g / square meter is used, and the six-flowered tool is processed according to the distribution cycle of the honeycomb unit, and the processing is completed. The level sequentially is aluminum skin / film / processed aramid meltblown nonwoven fabric / aluminum honeycomb core layer / after processing aramid meltblown nonwoven fabric / film / aluminum skin, in the hot press tank Curing at 0.3 MPa. After the curing is completed, it is processed into 60 * 60 standard test blocks and performs a flat pull strength test. The test results show that the pull-up strength of the honeycomb sandwich sheet prepared by the pr...

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Abstract

The invention relates to the technical field of honeycomb interlayers, in particular to a honeycomb interlayer preparation method for improving the bonding force of a honeycomb interlayer and the honeycomb interlayer. According to the preparation method, a glue-permeable organic soft fiber layer with nano-sized gaps is introduced between a glue film and a honeycomb core layer, and a guide structure is processed at a position, corresponding to a honeycomb unit, on the glue-permeable organic soft fiber layer, so that a glue solution is fully kept at an interface under the action of the surface tension of the glue solution; therefore, the excessive glue solution is guided to form glue bumps on the edges of the honeycomb, the whole glue solution can be guided and controlled, the defect that the glue bumps form at the bonding position is avoided, and the bonding force between the panel and the honeycomb core layer is improved. The whole process is simple, the structure of each part does not need to be changed, the bonding quality is high, and the prepared honeycomb structure has high bonding strength and mechanical performance.

Description

Technical field [0001] The present invention relates to the field of honeycomb interlayer, and more particularly to a honeycomb interlayer preparation method and a honeycomb clip layer in increasing honeycomb interlayer adhesion. Background technique [0002] The honeycomb interlayer structure has a large number of applications in the field of electromagnetic window expansion in onboard, airborne, carrier, and land base. The honeycomb interlayer structure has the advantages of high strength and light weight, and the electrical thickness can be designed and strong, and the core layer is filled. The dielectric properties can be changed, and the applications in the field of electrical structural function are further expanded. However, due to the structural characteristics of the honeycomb sandwich itself, the bonding of the core layer and the panel belongs to the plate bonding, low bonding efficiency, in particular in the common curing process, since the viscosity of the resin conta...

Claims

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Application Information

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IPC IPC(8): B29C70/34B29C70/54B32B5/02B32B3/14
CPCB29C70/342B29C70/545B32B5/02B32B3/14Y02T50/40
Inventor 唐培毅李南徐亮张春波魏建飞
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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