Heat-resistant UV viscosity-reducing adhesive tape

Abstract

The invention provides a heat-resistant UV viscosity-reducing adhesive tape which comprises a base material and an adhesive layer arranged on one side of the base material, a release coating is arranged on the side, opposite to the side where the adhesive layer is arranged, of the base material, the Young modulus of the adhesive layer at the temperature of 100 DEG C is 50000 Pa or above, the adhesive force of the adhesive layer to an adherend reaches 100 gf / 25 mm or above when the adhesive layer is used at the high temperature of 120 DEG C, and the adhesive force of the adhesive layer to the adherend reaches 100 gf / 25 mm or above when the adhesive layer is used at the high temperature of 120 DEG C. According to the present invention, the adhesive has good adhesion, can effectively prevent the falling, can substantially improve the yield, has the peeling force of less than 50 gf / 25 mm on the adherend under the normal temperature condition after the high temperature molding, can easily peel off, and can effectively improve the residual adhesive. By selecting the high-modulus acrylic acid series adhesive under the high-temperature condition, it is guaranteed that the high-modulus acrylic acid series adhesive has high elastic modulus during high-temperature forming, meanwhile, the photosensitizer and the UV resin are matched, viscosity reduction can be rapidly achieved in a UV short-time irradiation mode after use, the working efficiency is improved, and the amino-containing resin is adopted, so that the viscosity of the adhesive is reduced, and the service life of the adhesive is prolonged. And self-crosslinking curing can be carried out in a high-temperature environment, so that the hardness of the adhesive is improved, and the adhesive residue is effectively improved.

Description

technical field [0001] The invention relates to the technical field of composite material processing technology, in particular to a heat-resistant UV adhesive tape. Background technique [0002] With the continuous development of smart phones, especially 5G smart phones, in order to avoid interference of 5G signals, the back cover of smart phones no longer uses metal materials, but uses glass and composite materials, such as PC-PMMA composite materials, etc. . The processing of composite materials involves high-temperature molding process. In order to protect the surface of the material from being damaged during the molding process, it is necessary to attach a protective tape to one side of the composite material. The material is softened, and the composite material is molded with a mold. After the high-temperature molding process, it is cooled to room temperature and then the protective tape is peeled off. In the prior art, the adhesive tape in the prior art often falls o...

AI Technical Summary

Problems solved by technology

However, in the prior art, the adhesive tape in the prior art often falls off or bubbles due to insufficient viscosity during the high-temperature molding process, and the surface of the adherend will be polluted by residual glue. After molding, the peeling force is large under normal temperature conditions, making it difficult to peel off.

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