N-polarity GaN/AlGaN heterojunction epitaxial structure and preparation method thereof
An epitaxial structure, heterojunction technology, applied in climate sustainability, final product manufacturing, sustainable manufacturing/processing, etc., to suppress interfacial reactions, enhance 2D electron gas confinement, and reduce dislocations
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Embodiment 1
[0038] This embodiment provides a method for preparing an N-polar GaN / AlGaN heterojunction epitaxial structure, which specifically includes:
[0039] (1) Substrate pretreatment: Si(111) is used as the substrate for epitaxial growth, firstly in H 2 SO 4 、H 2 o 2 and H 2 Treatment in the mixed solution of O, the ratio of the mixed solution is H 2 SO 4 :H 2 o 2 :H 2 O=2:1:3, then put them into acetone and absolute ethanol in turn, ultrasonically clean them for 5 minutes respectively, take out the substrate and blow dry with high-purity nitrogen;
[0040] (2) Epitaxial growth of N-polar AlN buffer layer at low temperature: Using pulsed laser deposition (PLD) technology, put the pretreated substrate into the cavity, and evacuate until the pressure is less than 1.0×10 -6 torr, the substrate is first annealed at 800°C for 30 minutes in a nitrogen-rich atmosphere, and then the temperature is raised to 550°C to grow the N-polar AlN buffer layer. During the above growth proces...
Embodiment 2
[0052] This embodiment provides a method for preparing an N-polar GaN / AlGaN heterojunction epitaxial structure, which specifically includes:
[0053] (1) Substrate pretreatment: Si(111) is used as the substrate for epitaxial growth, firstly in H 2 SO 4 、H 2 o 2 and H 2 Treatment in the mixed solution of O, the ratio of the mixed solution is H 2 SO 4 :H 2 o 2 :H 2 O=2:1:3, then put them into acetone and absolute ethanol in turn, ultrasonically clean them for 10 minutes respectively, take out the substrate and blow dry with high-purity nitrogen;
[0054] (2) Epitaxial growth of N-polar AlN buffer layer at low temperature: Using PLD technology, put the pretreated substrate into the cavity, and vacuum until the pressure is less than 1.0×10 -6 torr, the substrate is first annealed at 800°C for 30 minutes in a nitrogen-rich atmosphere, and then the temperature is raised to 630°C to grow the N-polar AlN buffer layer. During the above growth process, the laser energy density...
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