Composition for forming heat-conducting material, heat-conducting material, heat-conducting sheet, and device with heat-conducting layer
A technology of thermally conductive materials and compositions, which can be used in semiconductor devices, heat exchange materials, semiconductor/solid-state device components, etc., and can solve problems such as difficulty in controlling heat in power semiconductor devices
Pending Publication Date: 2022-04-01
FUJIFILM CORP
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Heat generation from power semiconductor devices that have been densified due to miniaturization becomes difficult to control
Method used
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Examples
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Embodiment
[0773] Hereinafter, the present invention will be described in further detail based on examples. Materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted by the Examples shown below.
[0774] [Preparation and Evaluation of Composition]
[0775] [various ingredients]
[0776] Various components used in Examples and Comparative Examples are shown below.
[0777]
[0778] 〔Phenolic compounds〕
[0779] The phenolic compounds used in Examples and Comparative Examples are shown below.
[0780] In addition, the phenolic compound A-3 is Meiwa Plastic Industries, Ltd. MEH-7500.
[0781] [chemical formula 36]
[0782]
[0783] [chemical formula 37]
[0784]
[0785] (anhydride)
[0786] The acid anhydride A-6 used in Examples and Comparativ...
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Abstract
The present invention addresses the problem of providing a composition for forming a heat-conducting material, said composition being capable of obtaining a heat-conducting material having excellent heat conductivity. Another object of the present invention is to provide a heat-conducting material, a heat-conducting sheet, and a device with a heat-conducting layer, each of which is formed from the composition for forming a heat-conducting material. The composition for forming a thermally conductive material according to the present invention comprises: an epoxy compound; an inorganic substance; and a compound X having one or more functional groups selected from the group consisting of an alkenyl group, an acrylate group, a methacrylate group, a silyl group, an acid anhydride group, a cyanate group, an amino group, a thiol group, and a carboxylic acid group, or having a polyamic acid structure, the content of the inorganic substance being 10 mass% or more with respect to the total solid content of the composition. The content of the compound X is 10% by mass or more with respect to the total solid content of the composition.
Description
technical field [0001] The invention relates to a composition for forming a heat-conducting material, a heat-conducting material, a heat-conducting sheet and a device with a heat-conducting layer. Background technique [0002] In recent years, the miniaturization of power semiconductor devices used in various electrical equipment such as personal computers, general home appliances, and automobiles has rapidly progressed. Heat generated from power semiconductor devices that have been increased in density along with miniaturization has become difficult to control. [0003] To cope with this problem, thermally conductive materials that facilitate heat dissipation from power semiconductor devices are used. [0004] For example, Patent Document 1 discloses a "thermally conductive sheet comprising a sheet body formed of a thermosetting resin composition containing a thermosetting resin and inorganic nitride particles containing 50% by volume or more of the inorganic Nitride part...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C08L63/00C08L61/28C08L79/08C08K3/38C08K5/103C08K5/5419C08K5/09C08K5/18C08K5/37C08K5/092C08K9/04C08K3/22H01L23/367H01L23/373
CPCC08G59/621C08G59/245C08G59/3218C08G59/3245C08K3/38H01L23/3737C09K5/14C08K2003/385C08K5/13C08K9/04C08L63/00C08L83/04C08G77/20C08G59/34C08G59/688C08K3/22C08K2003/2227C08K2201/001
Inventor 人见诚一高桥庆太新居辉树林大介
Owner FUJIFILM CORP