Cutting process method of quartz wafer

A quartz wafer and cutting process technology, which is applied in the field of prefabricating microcracks on the surface of quartz wafers to cut quartz wafers, can solve problems such as edge effects and asymmetric cutting track offsets, and achieves solutions to edge effects and asymmetric cutting tracks. The effect of offset, improving work efficiency and reducing production cost

Pending Publication Date: 2022-04-05
TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
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Problems solved by technology

[0005] The invention provides a quartz wafer cutting process, which aims to solve the problems of edge effect and asymmetrical cutting track offset in the ex

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  • Cutting process method of quartz wafer

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[0019] The present invention provides a quartz wafer cutting process, which first uses a super thin diamond grinding wheel to prefabricate microcrack on the surface of the quartz wafer, and then preprocesses the quartz wafer surface by mixing solution, and then under prefabricated microcrack trajectory, The stress change caused by local thermal expansion caused by lasers, and the cutting of quartz wafers is achieved, and the specific steps are as follows:

[0020] A. Ultra-thin diamond grinding wheels having a thickness of 13 μm have a prefabricated width of the quartz wafer surface of 16 μm and a depth of 73 μm to satisfy the width of the silicon wafer sheet on the width of the silicon wafer.

[0021] b, preprocessing the quartz wafer surface with an acidic mixed solution, the acidic mixed solution component and weight ratio of HF: HNO3: H 2 O = 1: 2: 30, through the corrosion of the acid mixed solution, to ensure the depth of the prefabricated microcrack;

[0022] C. Using the l...

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Abstract

The invention relates to a quartz wafer cutting process method, which comprises the following steps of: firstly prefabricating microcracks on the surface of a quartz wafer by adopting an ultrathin diamond grinding wheel, then pretreating the surface of the quartz wafer by using a mixed solution, and then expanding the precracks by using stress change caused by local thermal expansion generated by laser to realize cutting of the quartz wafer. By the adoption of the quartz wafer cutting process method, a cut of a finished product can be smooth and flat, the problems of the edge effect, asymmetric cutting track deviation and the like existing in an existing laser hot cracking method cutting process are solved, and the purposes of improving the quartz wafer cutting quality, improving the working efficiency and reducing the production cost are achieved.

Description

technical field [0001] The invention relates to a cutting process method for a quartz wafer, in particular to a process method for cutting a quartz wafer by prefabricating micro-cracks on the surface of the quartz wafer. Background technique [0002] Wafer cutting (that is, dicing) is the process of dividing the entire wafer into a single chip (grain), which is an indispensable process in the chip manufacturing process. [0003] The traditional quartz wafer scribing process uses an ultra-thin diamond grinding wheel as a tool to cut the wafer, but the blade is prone to overload during the cutting process of the diamond grinding wheel, which affects the quality of dicing, resulting in damage to the side wall of the quartz wafer and chipping . In addition, when the diamond grinding wheel is scribing, due to the effect of surface tension, it is difficult for the cooling liquid to penetrate to the bottom of the wafer, and the cooling effect is poor, which makes the phenomenon of...

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Application Information

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IPC IPC(8): B28D5/00B23K26/38B23K26/402B23K26/60
Inventor 徐建民张勇吕振兴狄建兴苏皓王华恩王亮张淼宋建华周荣伟郝建军
Owner TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
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