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Cutting process method of quartz wafer

A quartz wafer and cutting process technology, which is applied in the field of prefabricating microcracks on the surface of quartz wafers to cut quartz wafers, can solve problems such as edge effects and asymmetric cutting track offsets, and achieves solutions to edge effects and asymmetric cutting tracks. The effect of offset, improving work efficiency and reducing production cost

Pending Publication Date: 2022-04-05
TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
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Problems solved by technology

[0005] The invention provides a quartz wafer cutting process, which aims to solve the problems of edge effect and asymmetrical cutting track offset in the existing laser thermal cracking cutting process, so as to improve the quality of wafer cutting, improve work efficiency, and reduce production. purpose of cost

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  • Cutting process method of quartz wafer

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Embodiment Construction

[0019] The invention provides a quartz wafer cutting process method, which first uses an ultra-thin diamond grinding wheel to prefabricate microcracks on the surface of the quartz wafer, then pretreats the surface of the quartz wafer through a mixed solution, and then under the guidance of the prefabricated microcrack track, The stress change caused by the local thermal expansion generated by the laser is used to expand the prefabricated crack to realize the cutting of the quartz wafer. The specific operation steps are as follows:

[0020] a. Use an ultra-thin diamond grinding wheel with a thickness of 13 μm to prefabricate microcracks with a width of 16 μm and a depth of 73 μm on the surface of the quartz wafer to meet the requirements for the slit width of the silicon wafer dicing;

[0021] B, carry out pretreatment to quartz wafer surface with acidic mixed solution, described acidic mixed solution component and weight ratio are HF: HNO3: H 2 O=1:2:30, through the corrosion ...

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Abstract

The invention relates to a quartz wafer cutting process method, which comprises the following steps of: firstly prefabricating microcracks on the surface of a quartz wafer by adopting an ultrathin diamond grinding wheel, then pretreating the surface of the quartz wafer by using a mixed solution, and then expanding the precracks by using stress change caused by local thermal expansion generated by laser to realize cutting of the quartz wafer. By the adoption of the quartz wafer cutting process method, a cut of a finished product can be smooth and flat, the problems of the edge effect, asymmetric cutting track deviation and the like existing in an existing laser hot cracking method cutting process are solved, and the purposes of improving the quartz wafer cutting quality, improving the working efficiency and reducing the production cost are achieved.

Description

technical field [0001] The invention relates to a cutting process method for a quartz wafer, in particular to a process method for cutting a quartz wafer by prefabricating micro-cracks on the surface of the quartz wafer. Background technique [0002] Wafer cutting (that is, dicing) is the process of dividing the entire wafer into a single chip (grain), which is an indispensable process in the chip manufacturing process. [0003] The traditional quartz wafer scribing process uses an ultra-thin diamond grinding wheel as a tool to cut the wafer, but the blade is prone to overload during the cutting process of the diamond grinding wheel, which affects the quality of dicing, resulting in damage to the side wall of the quartz wafer and chipping . In addition, when the diamond grinding wheel is scribing, due to the effect of surface tension, it is difficult for the cooling liquid to penetrate to the bottom of the wafer, and the cooling effect is poor, which makes the phenomenon of...

Claims

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Application Information

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IPC IPC(8): B28D5/00B23K26/38B23K26/402B23K26/60
Inventor 徐建民张勇吕振兴狄建兴苏皓王华恩王亮张淼宋建华周荣伟郝建军
Owner TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
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