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Thickness measuring structure and measuring method for aluminum-gallium-nitrogen barrier layer

A technology of thickness measurement and barrier layer, applied in semiconductor/solid-state device testing/measurement, electrical components, electric solid-state devices, etc., can solve problems such as poor Schottky contact, unknown proportion of Al composition, large error, etc. Achieve high accuracy and consistency, simple and easy-to-operate measurement method

Pending Publication Date: 2022-04-05
苏州英嘉通半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The capacitance value C in the above formula is obtained from actual measurement, and the vacuum dielectric constant ε 0 =8.854187817E-12F / m, the plate area S is the process design value, the dielectric constant ε of the AlGaN barrier layer can be obtained according to the empirical formula ε=9.5-0.5x, x is the proportion of the Al component in the AlGaN barrier layer, Therefore, the premise of using this method to measure the thickness of the AlGaN barrier layer is to know the proportion of Al composition in AlGaN. However, the actual situation is that when the thickness of the AlGaN barrier layer is not known, the proportion of Al composition is often unknown.
In addition, if the quality of the AlGaN barrier layer is low and there is a large leakage, or the Schottky contact is poor, the error of the result calculated by the above method will also be large

Method used

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  • Thickness measuring structure and measuring method for aluminum-gallium-nitrogen barrier layer
  • Thickness measuring structure and measuring method for aluminum-gallium-nitrogen barrier layer
  • Thickness measuring structure and measuring method for aluminum-gallium-nitrogen barrier layer

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Experimental program
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Embodiment 1

[0062] ginseng figure 1 As shown, the AlGaN barrier layer thickness measurement structure in this embodiment includes

[0063] Substrate 10, substrate is silicon (Si), sapphire (Al 2 o 3 ), silicon carbide (SiC), etc.;

[0064] The heterojunction located on the substrate, the heterojunction includes a gallium nitride channel layer 30 and an aluminum gallium nitride barrier layer 40, and two Dimensional electron gas (Two-dimensional electron gas, 2DEG), the thickness of the gallium nitride channel layer is 50nm ~ 2μm, the aluminum gallium nitrogen barrier layer is Al x Ga 1-x The N (x=0.1-0.3) barrier layer has a thickness of 10nm-50nm.

[0065] The measurement structure in this embodiment also includes a buffer layer 20 located between the substrate and the heterojunction. The buffer layer is mainly made of nitride, including gallium nitride, aluminum nitride, aluminum gallium nitride and the like.

[0066] Further, an isolation layer, such as an AlN spacer, is formed be...

Embodiment 2

[0098] In an actual process, the thickness of the first passivation layer may be small, and the test structure group can be increased by using the second passivation layer, and the test results of multiple groups of test structures can be compared and verified.

[0099] combine Figure 4 As shown, the measurement structure in this embodiment is substantially the same as that in Embodiment 1, except that a second passivation layer 62 is formed on the first passivation layer 61 .

[0100] The material of the second passivation layer can be an insulating medium such as silicon nitride, silicon oxide or polyimide, or a composite medium composed of various insulating mediums, and the thickness can be 100 nm˜1 μm.

[0101] ginseng Figure 5 Shown is a top view of the measurement structure. The left area is the upper plate of the first parallel plate capacitor, and the right area is the upper plate of the second parallel plate capacitor. The lower plates of the two capacitors pass t...

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Abstract

The invention discloses an aluminum gallium nitride barrier layer thickness measurement structure and a measurement method. The measurement structure comprises a substrate; the heterojunction is located on the substrate and comprises a gallium nitride channel layer and an aluminum-gallium-nitrogen barrier layer, and two-dimensional electron gas is formed at the interface of the gallium nitride channel layer and the aluminum-gallium-nitrogen barrier layer; the first metal layer is located on the heterojunction, and the first metal layer is electrically connected with the two-dimensional electron gas; the passivation layer is located on the first metal layer and the heterojunction; and the second metal layer comprises a first metal pole plate and a second metal pole plate, wherein the first metal pole plate is completely or partially positioned in an area above the first metal layer, and the second metal pole plate is completely or partially positioned in an area above the two-dimensional electron gas. According to the measurement structure, the first parallel plate capacitor not containing the aluminum gallium nitrogen barrier layer and the second parallel plate capacitor containing the aluminum gallium nitrogen barrier layer can be formed, and the thickness of the aluminum gallium nitrogen barrier layer can be finally obtained based on a voltage-capacitance characteristic test and a parallel plate capacitor capacitance formula.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an aluminum gallium nitrogen barrier layer thickness measurement structure and a measurement method. Background technique [0002] A high concentration of two-dimensional electron gas (Two-dimensional electron gas, 2DEG) will be formed at the interface of AlGaN / GaN heterojunction due to material polarization, and it has high carrier saturation mobility It can be said that the AlGaN / GaN heterojunction structure is the cornerstone of the GaN-based high electron mobility transistor (HMET). [0003] In epitaxial growth, the concentration of two-dimensional electron gas directly depends on the thickness of the AlGaN barrier layer and the content of Al composition, which will ultimately affect the current characteristics of the device. The thickness of the AlGaN barrier layer or the Al component content can be measured by some means, such as: scanning electron micro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L21/66
Inventor 宁殿华蒋胜柳永胜程新
Owner 苏州英嘉通半导体有限公司
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