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BIPV intelligent chip photovoltaic module and packaging process thereof

A technology of smart chips and photovoltaic modules, applied in photovoltaic power generation, electrical components, semiconductor devices, etc., can solve the problems of system power generation decline, output power decline, and component loss, etc., to increase power generation and reduce battery stalls , The effect of high power generation

Pending Publication Date: 2022-04-12
SUZHOU AIKANG LOW CARBON TECH INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional photovoltaic modules are connected using junction boxes with bypass diodes. The disadvantage is that once the hot spots are caused by shading or defects in the battery itself, the bypass diodes will start, and the battery strings corresponding to the diodes will be short-circuited, and the output power of the modules will drop by at least 1 / 3. At the same time, the system is prone to problems such as current and voltage mismatch, hot spots, shading, and dust occlusion, resulting in a decrease in power generation of the entire system
[0004] With the advancement of technology, the development of photovoltaic power plants in the future must develop in the direction of intelligence, and the intelligentization of power stations must first realize the intelligence of components. At present, the more common smart photovoltaic modules are photovoltaic modules with smart junction boxes. Through Glue the smart junction box behind the ordinary components, realize MPPT in the battery slice cascading level, and reduce LCOE, but because of the intelligent optimization at the electrical device level, the reliability depends on the life of the electrical components, and it is exposed to the atmospheric environment, so the reliability is poor ; At the same time, the loss of components is large, resulting in low efficiency of components

Method used

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  • BIPV intelligent chip photovoltaic module and packaging process thereof
  • BIPV intelligent chip photovoltaic module and packaging process thereof
  • BIPV intelligent chip photovoltaic module and packaging process thereof

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Embodiment 1

[0037] see Figure 1-3 , a kind of BIPV smart chip photovoltaic assembly that the present invention relates to, it comprises BIPV assembly 1, front plate toughened glass 2, smart chip box 4 and back plate tempered glass 7, described BIPV assembly 1 comprises 4 strings of battery strings, each string of batteries The string is composed of 10 solar cells 3 connected in series, that is, a total of 40 solar cells 3. A smart chip box 4 is arranged between the two adjacent battery strings on the left. The room also has a smart chip box 4.

[0038] The front side of the battery string array of the BIPV module 1 is connected to the front tempered glass 2 through the adhesive film 6, and the back side is connected to the back tempered glass 7 through the adhesive film 6, and the adhesive film 6 is POE adhesive film or EVA adhesive film.

[0039] The smart chip box 4 is provided with a smart chip 5, the left end of the smart chip 5 is provided with a bus bar 8 extending out of the smar...

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Abstract

The invention relates to a BIPV intelligent chip photovoltaic module and a packaging process thereof, the BIPV intelligent chip photovoltaic module comprises a BIPV module, front plate toughened glass, intelligent chip boxes and back plate toughened glass, the BIPV module comprises a plurality of battery strings, each battery string is formed by connecting a plurality of solar battery pieces in series, one intelligent chip box is arranged between two adjacent battery strings at the left part, and the back plate toughened glass is arranged on the back plate toughened glass. Another intelligent chip box is also arranged between two adjacent battery strings at the right part; an intelligent chip is arranged in the intelligent chip box, a bus bar is arranged at the left end of the intelligent chip and extends out of the intelligent chip box to be connected with an adjacent solar cell, and a bus bar is arranged at the right end of the intelligent chip and extends out of the intelligent chip box to be connected with an adjacent solar cell. According to the invention, the intelligent chip is packaged in the photovoltaic module, and the chip is connected in series with the two columns of battery pieces, so that the power optimization of the sub-cascade crystalline silicon battery pieces is realized, the output of electric energy is increased, the reliability of the module is enhanced, the BIPV of the crystalline silicon intelligent photovoltaic module is realized, and the photovoltaic module can be installed on each building elevation.

Description

technical field [0001] The invention relates to the technical field of solar photovoltaic components, in particular to a BIPV smart chip photovoltaic component and its packaging process. Background technique [0002] Conventional crystalline silicon photovoltaic modules are installed on various facades or facades with different angles. Due to the uneven radiation received by the surface of each module, the power generation of the system will decrease. [0003] Photovoltaic modules are composed of certain specifications and quantities of solar cells combined in series and parallel and packaged together. Since the current and voltage of a single solar cell are very small, we first connect them in series to obtain a high voltage, and then connect them in parallel to obtain a high current, and then output it through an anti-backflow diode. Conventional photovoltaic modules are connected using junction boxes with bypass diodes. The disadvantage is that once the hot spots are cau...

Claims

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Application Information

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IPC IPC(8): H01L31/048H01L31/05
CPCY02E10/50
Inventor 周锋
Owner SUZHOU AIKANG LOW CARBON TECH INST
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