Manufacturing method of glass-based LED light-emitting module

Abstract

The invention discloses a manufacturing method of a glass-based LED (light-emitting diode) light-emitting module, which comprises the following steps of: performing corrosion or etching treatment on the surface of glass by taking a strong-corrosion-resistant film material as a mask to form a regular groove array structure; fixing a chip in the glass plate groove to form a glass plate provided with a high-density chip array; and aligning and attaching the glass plate provided with the conductive circuit and the glass plate of the chip array, and then carrying out laser local heating and reflow soldering treatment to form a structure that the conductive circuit glass plate, the chip and the groove array glass plate are connected into a whole. The groove array glass plate can be separated from the chip, the groove array glass plate can be repeatedly used after being cleaned, the repeatability is high, and the method is suitable for mass production. Or insulating, colorless and transparent glue is directly filled between the conductive circuit glass plate and the groove array glass plate, and a sealing structure is formed on the periphery, so that the light-emitting module is formed. And the formed light-emitting module can be subjected to double-sided thinning treatment to form the glass-based light-emitting module with the required specification.

Description

technical field [0001] The invention relates to the technical field of LED light-emitting chip modules, in particular to a method for manufacturing a glass-based LED light-emitting module. Background technique [0002] OLED display technology has fatal problems of high cost, poor reliability, and short lifespan, while Mini LED liquid crystal displays have the advantages of high peak brightness, wide color gamut, high dynamic contrast ratio (HDR), high reliability, long life, and thinness. This Mini LED direct-lit liquid crystal display backlight technology, as a new display technology with broad application prospects, is favored by the industry. The development of this technology will create an opportunity for the upgrading of the TFT-LCD display industry and boost the competition between the LCD and OLED industries. [0003] However, the traditional Mini LED backlight module is based on the Mini LED chip array on the PCB. Compared with the glass-based Mini LED module, the ...

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Problems solved by technology

[0003] However, the traditional Mini LED backlight module is based on the Mini LED chip array on the PCB. Compared with the glass-based Mini LED module, the PCB-based Mini LED light-emitting module is more difficult to process, the cost is high, and the near-zero OD There are no advantages in module thickness control, large-scale processing, alignment, and flatness

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