Packaging, aligning and laminating device and packaging, aligning and laminating control method

Abstract

The invention provides a packaging, aligning and laminating device and a packaging, aligning and laminating control method, and relates to the technical field of semiconductor packaging, the packaging, aligning and laminating device comprises a support, the support comprises an adsorption platform used for fixing a chip, the periphery of the adsorption platform is provided with an adjusting mechanism and a baffle plate so as to form an accommodating area in an enclosing manner, conductive glass is arranged on the side, provided with the frame glue, of the chip through the containing area, and the adjusting mechanism adjusts the range of the containing area; a movable vibration module and a movable curing module are further arranged above the adsorption platform, the vibration module can move to the conductive glass and pressurize the conductive glass so as to transmit high-frequency oscillation to the frame glue between the chip and the conductive glass, spacers of the frame glue are distributed in a single-layer mode, and the uniformity of cell gap in the box pressing process is improved; the curing module is used for providing radiation energy for the frame glue to cure the frame glue. And a box pressing process and a curing process are integrated together, so that the yield, the efficiency and the reliability of an LCOS packaging test are realized.

Description

technical field [0001] The present application relates to the technical field of semiconductor packaging, and in particular to a packaging alignment bonding device and a control method for packaging alignment bonding. Background technique [0002] Liquid Crystal on Silicon (LCoS) is a reflective microdisplay device. Compared with transmissive liquid crystal, it has the advantages of small size, high resolution and high light utilization rate (high aperture ratio), especially the pure phase modulation type. LCoS spatial light modulator, because it can flexibly and conveniently modulate the light wave front, has extremely important applications in the fields of optical communication, digital holography, micro-optics, etc. It is a wavelength selective switch (WSS), maskless lithography system, holography The core component of the optical tweezers system. [0003] Compared with the preparation of traditional transmissive liquid crystal devices, the preparation of LCoS devices i...

AI Technical Summary

Problems solved by technology

[0003] Compared with the preparation of traditional transmissive liquid crystal devices, the preparation of LCoS devices is more difficult. The difficulties in the preparation are mainly reflected in the smaller size of LCoS devices and the higher requirements for alignment and bonding accuracy of ITO glass and silicon substrates; the sealing of liquid crystals. The frame glue is narrower (about 500um), and spacers with a certain diameter are mixed in it, so it is more difficult to control the uniformity of the overall liquid crystal cell thickness in the process

Images