Supercharge Your Innovation With Domain-Expert AI Agents!

Self-curing resin as well as preparation method and application thereof

A self-curing, resin technology, used in chemical instruments and methods, applications, other household appliances, etc., can solve problems such as difficulty in ensuring uniform dispersion of curing agents, uneven curing crosslinking density of thermosetting resins, and differences in mechanical properties and thermal properties. , to achieve excellent thermal and mechanical properties, avoid excessive cross-linking, and achieve stable and controllable processes

Pending Publication Date: 2022-05-06
ZHEJIANG WAZAM NEW MATERIAL CO LTD +2
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of using thermosetting resin to prepare circuit boards, in order to cure the thermosetting resin, it is necessary to add a curing agent to the thermosetting resin; Conditions and the influence of factors such as the viscosity of the thermosetting resin, it is difficult to ensure that the curing agent is uniformly dispersed in the thermosetting resin, resulting in uneven curing crosslinking density of the thermosetting resin, which in turn leads to differences in mechanical properties and thermal properties in different regions of the circuit substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Self-curing resin as well as preparation method and application thereof
  • Self-curing resin as well as preparation method and application thereof
  • Self-curing resin as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The invention also provides a preparation method of the self curing resin as described above, comprising the following steps:

[0027] S1, providing a first thermosetting resin with an epoxy value of 0.20-0.60;

[0028]S2, the first thermosetting resin is subjected to ring opening reaction to obtain an intermediate. The molecular chain of the intermediate includes hydroxyl and epoxy group, and the molar ratio of hydroxyl to epoxy group is 1:2-1:20; as well as

[0029] S3, the intermediate is substituted with haloalkyne to obtain self curing resin.

[0030] In the preparation method of self curing resin, the first thermosetting resin with specific epoxy value is used as raw material, and part of the epoxy group in the first thermosetting resin is opened and replaced by Haloalkynes, so that the unsaturation of the self curing resin is increased by 10% ~ 70% compared with that of the first thermosetting resin, and the simple preparation of self curing resin is realized.

[003...

Embodiment 1

[0070] Provide epoxy resin with epoxy value of 0.43.

[0071] The ring opening reaction of epoxy resin is carried out in the presence of ring opening reaction catalyst dodecyl dimethyl amine and ring opening reaction assistant formic acid. According to the molar ratio of cycloxy, formic acid and dodecyl dimethyl amine in epoxy resin is 25:5:1, the intermediate is obtained. The molecular chain of the intermediate includes hydroxyl and epoxy group, and the molar ratio of hydroxyl to epoxy group is 1:4.

[0072] Add the intermediate into butanol, stir under the water bath condition of 50 ℃ to mix evenly, slowly drop 0.8mol / l potassium hydroxide solution, and slowly drop 3-bromopropyne under the water bath condition of 65 ℃, the molar ratio of 3-bromopropyne to hydroxyl group in the intermediate is 1:1. After reacting at 65 ℃ for 4h, wash in batches with hot deionized water and ethanol to remove the salt formed by the reaction, and obtain Brown resin after liquid separation and spin e...

Embodiment 2

[0077] Example 2 is carried out with reference to example 1. The difference is that the epoxy value of epoxy resin is 0.20; The molecular chain of the intermediate includes hydroxyl group and epoxy group, and the molar ratio of hydroxyl group to epoxy group is 1:4; The molecular chain of self curing resin includes alkynyl group and epoxy group. The molar ratio of alkynyl group to epoxy group is 1:4. The mass fraction of epoxy group in self curing resin is 6.9%, and the mass fraction of alkynyl group in self curing resin is 1.72%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
tensile strengthaaaaaaaaaa
epoxy valueaaaaaaaaaa
Login to View More

Abstract

The invention relates to self-curing resin as well as a preparation method and application thereof. A molecular chain of the self-curing resin comprises alkynyl and epoxy groups, the mass fraction of the epoxy groups in the self-curing resin is 5%-25%, and the molar ratio of the alkynyl to the epoxy groups is 1: 2-1: 20. When the self-curing resin is used for preparing the circuit substrate, a curing agent does not need to be additionally added, the curing reaction process is simplified, the temperature of the curing reaction is reduced, the time is shortened, the process of the curing reaction is stable and controllable, and the prepared circuit substrate has excellent thermal properties and mechanical properties.

Description

technical field [0001] The invention relates to the technical field of electronic industry, in particular to a self curing resin and a preparation method and application thereof. Background technology [0002] In the process of preparing circuit substrate with thermosetting resin, in order to cure the thermosetting resin, it is necessary to add curing agent to the thermosetting resin; However, the traditional technology is to mix the curing agent with the thermosetting resin under the condition of stirring. Affected by the mixing conditions and the viscosity of the thermosetting resin, it is difficult to ensure that the curing agent is evenly dispersed in the thermosetting resin, resulting in uneven curing crosslinking density of the thermosetting resin, which leads to differences in mechanical and thermal properties in different areas of the circuit substrate. summary of the invention [0003] Based on this, it is necessary to provide a self curing resin and its preparation met...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/10C08K3/36C08K7/14C08J5/24B32B17/02B32B17/12B32B15/20B32B15/14B32B33/00B32B37/06B32B37/10B32B37/00B32B38/00
CPCC08K3/36C08K7/14C08J5/24B32B5/02B32B5/26B32B15/20B32B15/14B32B33/00B32B37/06B32B37/1018B32B37/00B32B38/0036B32B2037/243B32B2038/0076B32B2262/101B32B2255/02B32B2255/26B32B2457/08C08J2363/10C08L63/10
Inventor 魏俊麒韩梦娜任英杰董辉何双雷恒鑫
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com