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Method for improving bonding strength of metal bonding layer and ceramic layer of thermal barrier coating

A technology of metal bonding layer and thermal barrier coating, which is applied in the direction of coating, metal material coating process, fusion spraying, etc., can solve the problem of limited improvement of bonding strength and other problems

Pending Publication Date: 2022-05-06
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] That is to say, in the currently published methods, the ceramic layer and the metal bonding layer are still mechanically bonded in essence, and the level of bonding strength improvement is limited.

Method used

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  • Method for improving bonding strength of metal bonding layer and ceramic layer of thermal barrier coating
  • Method for improving bonding strength of metal bonding layer and ceramic layer of thermal barrier coating
  • Method for improving bonding strength of metal bonding layer and ceramic layer of thermal barrier coating

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Embodiment

[0045] The substrate is made of Mar-M247 nickel-based superalloy with a diameter of 25.4mm and a thickness of 3mm. The metal bonding layer powder is made of CoNiCrAlY powder with a particle size of 22-45μm. The ceramic layer powder is made of smelted and broken yttrium oxide with a particle size of 10-30μm. Stabilized Zirconia (YSZ).

[0046] A metal bonding layer with a thickness of 150 μm was prepared by supersonic flame spraying. The specific spraying parameters were: oxygen flow rate 1800 SCFH, kerosene flow rate 5.5 GPH, powder feeding rate 65 g / min, and spraying distance 380 mm.

[0047] Then heat treat the superalloy with metal bonding layer in a vacuum furnace. The heat treatment parameters are: oxygen concentration 10ppm, heating rate 4°C / min, heat up to 1100°C for 4 hours, and cool down to 4°C / min. room temperature.

[0048] use figure 1 In the device shown, the surface of the metal bonding layer is preheated to 400-450°C, and a YSZ ceramic layer with a thickness o...

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Abstract

The invention discloses a method for improving the bonding strength of a metal bonding layer and a ceramic layer of a thermal barrier coating, which comprises the following steps of: preparing the metal bonding layer on nickel-based high-temperature alloy, and performing heat treatment under low oxygen partial pressure to generate a layer of continuous, uniform and compact alpha-Al2O3 film on the surface of the metal bonding layer. Converting the metal surface of the metal bonding layer into an alpha-Al2O3 ceramic surface which is chemically bonded with the metal bonding layer; and then the surface of the metal bonding layer is heated to a specific temperature or above, ceramic layer powder is deposited on the surface of the metal bonding layer by using an atmospheric plasma spraying technology, so that the spanning from mechanical bonding to chemical bonding between the ceramic layer and the metal bonding layer of the thermal barrier coating prepared by thermal spraying can be realized, and the bonding strength of the ceramic layer and the metal bonding layer is improved.

Description

technical field [0001] The invention belongs to the technical field of material processing, and in particular relates to a method for improving the bonding strength of a metal bonding layer and a ceramic layer of a thermal barrier coating. Background technique [0002] Thermal barrier coating is a kind of coating technology widely used on hot-end parts such as combustion chambers and turbine blades of gas turbines or aero-engines. Its main function is to protect the turbine and combustion chamber from serving safely at high temperatures through heat insulation , thereby improving the life of high-temperature components and energy efficiency. Thermal barrier coatings consist of a metallic bond layer and a ceramic layer. The role of the metal bonding layer is to protect the superalloy substrate from oxidation and thermal corrosion, alleviate the thermal expansion coefficient mismatch between the substrate and the ceramic layer, and provide a better bonding interface for the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/134C23C4/129C23C4/073C23C4/18C23C4/10
CPCC23C4/134C23C4/129C23C4/073C23C4/18C23C4/10
Inventor 李长久王伟雒晓涛
Owner XI AN JIAOTONG UNIV