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Modified polyphenyl ether resin and boron nitride composite material with low dielectric constant

A technology of polyphenylene ether resin and low dielectric constant, which is applied in the field of modification of communication materials, can solve the problems of PPO mechanical and thermodynamic performance degradation, poor processing and molding performance of polyphenylene ether, and the inability to use injection methods, etc., to achieve freedom Increased volume, strong anti-aging ability, and the effect of reducing the dielectric constant

Inactive Publication Date: 2022-05-10
广东粤化新材料技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyphenylene ether is similar to Newtonian fluid, with poor fluidity, viscosity sensitive to temperature, and easy to decompose
Therefore, the processing and molding performance of polyphenylene ether is extremely poor, and pure polyphenylene ether cannot be molded by injection, which greatly limits the application of polyphenylene ether.
Adding fillers such as talcum powder or mica can improve the fluidity of PPO to a certain extent, but such fillers will reduce the mechanical and thermodynamic properties of PPO, which cannot meet the performance requirements of some fields.

Method used

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  • Modified polyphenyl ether resin and boron nitride composite material with low dielectric constant
  • Modified polyphenyl ether resin and boron nitride composite material with low dielectric constant
  • Modified polyphenyl ether resin and boron nitride composite material with low dielectric constant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The specific formula is:

[0034]

[0035] The preparation method is as follows: 1) Mix and stir the modified polyphenylene ether resin, hexagonal boron nitride, inorganic filler A, antioxidant combination a, compatibilizer, and microporous material for 5 minutes to 10 minutes to obtain a mixed material; 2) mix the The finished material is heated in an environment of 190 ° C ~ 230 ° C, and the heating time lasts for 30 min ~ 50 min; the strip material is extruded, and the cut surface diameter of the strip material is 2-6 mm. 3) The extruded strip material is cooled by cooling water tank Start pelletizing at 60-70°C, the particle size is 2-5mm, then put the pellets into absolute ethanol to wash, dry and obtain the low dielectric constant modified polyphenylene ether resin and boron nitride composite in Example 1 Material.

[0036] The preparation method of Examples 2-8 is the same as that of Example 1, except that the amount of modified polyphenylene ether resin is d...

Embodiment 9

[0051] The specific formula is:

[0052]

[0053] The preparation method is as follows: 1) Mix and stir the modified polyphenylene ether resin, hexagonal boron nitride, inorganic filler A, antioxidant combination a, compatibilizer, and microporous material for 5 minutes to 10 minutes to obtain a mixed material; 2) mix the The finished material is heated in an environment of 190 ° C ~ 230 ° C, and the heating time lasts for 30 min ~ 50 min; the strip material is extruded, and the cut surface diameter of the strip material is 2-6 mm. 3) The extruded strip material is cooled by cooling water tank When the temperature reaches 60-70°C, pelletizing starts, and the particle size is 2-5 mm. Then, the pellets are washed in absolute ethanol, and dried to obtain the modified polyphenylene ether resin and boron nitride composite material in Example 9.

[0054] The preparation method of Examples 10-16 is the same as that of Example 9, and the first group of modified polyphenylene ether ...

Embodiment 17

[0068] The specific formula is:

[0069]

[0070] The preparation method is as follows: 1) Mix and stir the modified polyphenylene ether resin, hexagonal boron nitride, inorganic filler B, antioxidant combination a, compatibilizer, and microporous material for 5 minutes to 10 minutes to obtain a mixed material; 2) mix the The finished material is heated in an environment of 190 ° C ~ 230 ° C, and the heating time lasts for 30 min ~ 50 min; the strip material is extruded, and the cut surface diameter of the strip material is 2-6 mm. 3) The extruded strip material is cooled by cooling water tank When the temperature reaches 60-70°C, pelletizing starts, and the particle size is 2-5mm. Then, the pellets are washed with absolute ethanol, and the composite material of Example 17 is obtained after drying.

[0071] The preparation methods of Examples 18-24 are the same as those of Example 17, except that the inorganic filler B and the amount of modified polyphenylene ether resin us...

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Abstract

The invention provides a low-dielectric constant modified polyphenyl ether resin and boron nitride composite material, the raw materials comprise modified polyphenyl ether resin, boron nitride, an inorganic filler, an antioxidant, a compatilizer and a microporous material, the polyphenyl ether resin is subjected to fluorination modification in the modification process, the free volume of a polymer in the material is increased, the dielectric constant is reduced, and the dielectric constant is improved. The dielectric constant of the prepared material is 1.5-2.2, and a structure prepared from the material has the advantages of being timely in signal transmission, small in noise interference, low in power loss and the like. And the fluidity and temperature sensitivity of the polyphenyl ether resin can be greatly improved by modifying the polyphenyl ether resin, and the tensile strength of the composite material is improved.

Description

technical field [0001] The invention belongs to the field of modification of communication materials, in particular to a low dielectric constant modified polyphenylene ether resin and boron nitride composite material. Background technique [0002] Low dielectric materials are conducive to better transmission of electromagnetic signals. Therefore, the scientific and industrial circles around the world have realized the importance of the development of materials in the 5G era, and are committed to research and development of cost-effective, environmentally friendly, and healthy low-dielectric materials. Dielectric, low loss reinforced compound. [0003] With the development of 5G communication technology, it will be widely used in smart phones, tablets, laptops, wearable devices, smart homes, smart home appliances, smart media, smart cars, smart transportation and other fields. At the same time, the demand for low dielectric constant materials matching 5G communication equipm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L25/06C08L51/08C08K3/38C08K3/22C08K7/14C08K7/26C08K5/13C08K5/526
CPCC08L71/126C08K2003/385C08K2201/011C08K2003/2227C08K2003/2224C08L2201/02C08K2003/387C08L2205/08C08L2203/20C08L25/06C08L51/08C08K3/38C08K3/22C08K7/14C08K7/26C08K5/13C08K5/526
Inventor 孙小波汪德瑜
Owner 广东粤化新材料技术开发有限公司