Surface-mounted thick film fuse structure and manufacturing method thereof

A fuse, surface-mounted technology, applied in the surface-mounted thick-film fuse structure and its manufacturing field, can solve problems such as increasing the rated voltage arc, and achieve the effects of high quality consistency, high reliability, and low cost

Pending Publication Date: 2022-05-10
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is: to solve the co

Method used

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  • Surface-mounted thick film fuse structure and manufacturing method thereof
  • Surface-mounted thick film fuse structure and manufacturing method thereof
  • Surface-mounted thick film fuse structure and manufacturing method thereof

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specific Embodiment approach

[0037] combine Figure 2 、 Figure 3 The specific implementation of the technical scheme of the invention is as follows:

[0038] (1) Material preparation: a ceramic substrate is selected as a substrate substrate, and according to the arrangement and layout size of fuses, a dicing machine is used to scribe the split lines (i.e., scribe the grooves for splitting individual fuse chips) on the ceramic substrate.

[0039](2) Screen printing a front electrode and a back electrode on the surface of the scribed ceramic substrate, wherein the main components of the front electrode and the back electrode are silver palladium, and the palladium content is 1%-35%.

[0040] (3) preparing a thermal insulation layer on the surface of the ceramic substrate with electrodes, wherein the main component of the thermal insulation layer is silica, the firing temperature of the thermal insulation layer is 850℃ 30℃, and the firing film thickness of the thermal insulation layer is 10μ m ~ 100μ m.

[0041] ...

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Abstract

The invention discloses a surface-mounted thick film fuse structure and a manufacturing method thereof, and belongs to the field of electronic components. Comprising a substrate, a back electrode, a surface electrode, a heat insulation layer, a fuse link layer, an encapsulation layer, an end electrode, a fuse link body, a fuse wire isolation through hole and a fuse wire, the substrate is made of a high-temperature-resistant insulating material, the back electrodes are located at the two ends of the back face of the substrate, the surface electrodes are located at the two ends of the surface of the substrate, the heat insulation layer is located on the surface of the substrate, the fuse-link layer is located on the surface of the heat insulation layer, the encapsulation layer is located on the surface of the fuse-link layer, and the end electrodes cover the back electrodes, the surface electrodes and the two ends of the substrate. The fuse isolation through holes penetrate through the fuse link body, the shape, the number, the size and the arrangement mode of the isolation through holes are set according to the specific performance of the fuse, and the fuse is manufactured by adopting a thick film integrated process technology. The problem of contradiction between rated voltage improvement and electric arc reduction in the prior art is solved. The fuse is widely applied to the field of miniaturized, high-working-voltage, low-arc and high-reliability fuses.

Description

Technical field [0001] The invention belongs to the field of electronic components, and further relates to the field of film fuses, in particular to a surface-mounted thick-film fuse structure and a manufacturing method thereof. technical background [0002] Among electronic components, fuse is a kind of component which is connected in series in electronic circuit and used as overcurrent protection. When the circuit current exceeds the specified value and lasts for a certain time, the heat generated by the fuse link itself exceeds the emitted heat, and the temperature of the fuse link reaches its melting point, so that the fuse link is fused, thus achieving the purpose of overcurrent protection. [0003] As for surface-mounted thick-film fuse, it is widely used in aerospace, aviation, electronics, shipping and other fields because of its small size, stable electrical performance, high reliability and suitability for direct welding and installation on PCB. The structure of the fus...

Claims

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Application Information

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IPC IPC(8): H01H85/041H01H69/02
CPCH01H85/0411H01H69/022H01H2085/0412
Inventor 雷巧林杨舰李厚忠张敏徐东韩玉成
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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