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Porous structure surface with high capillary performance and high boiling heat transfer performance and preparation method thereof

A porous structure and pore wall technology, applied in the field of material science, can solve the problems of poor capillary performance of the liquid-absorbing core, poor boiling heat transfer performance, etc., and achieve a wide range of applications, high boiling heat transfer performance, and short production cycle Effect

Pending Publication Date: 2022-05-13
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the traditional liquid-absorbing core structures are micron and millimeter-scale structures with large sizes, resulting in poor capillary performance of the liquid-absorbing core, which in turn leads to poor boiling heat transfer performance

Method used

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  • Porous structure surface with high capillary performance and high boiling heat transfer performance and preparation method thereof
  • Porous structure surface with high capillary performance and high boiling heat transfer performance and preparation method thereof
  • Porous structure surface with high capillary performance and high boiling heat transfer performance and preparation method thereof

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Embodiment 1

[0028] 1. Metal substrate treatment: first use dilute sulfuric acid solution to remove surface oxides, then use high-concentration hot alkali solution to clean the surface oil, and then use deionized high-purity water to rinse 3 times.

[0029] 2. Deposition on the surface of the porous structure: use the constant current method, take the treated metal substrate surface as the cathode, in the solution of sulfuric acid and copper sulfate as the electrolyte, the concentration of sulfuric acid is 1.0 M, the concentration of copper sulfate is 0.4 M, and the current is maintained Density is 0.5A / cm 2 , The reaction time is 6min.

[0030] 3. Heat treatment of the product: Sintering is carried out under the condition of reducing protective atmosphere, the sintering temperature is 800°C, and the heat preservation is 120min to further enhance the mechanical strength of the product.

[0031] After the treatment is completed, the top view SEM figure of embodiment 1 and the SEM figure of...

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Abstract

The invention discloses a porous structure surface with high capillary performance and high boiling heat transfer performance and a preparation method thereof. The surface structure is a honeycomb-shaped porous copper structure and is provided with holes with micro-nano-scale pore diameters, hole walls are composed of copper crystal branches, staggered channel structures are formed between main trunks of the crystal branches, and due to the existence of micron-scale honeycomb holes, the flowing resistance of a working medium is reduced; and abundant branches of the crystal dendrites form nano-scale holes to provide capillary force, so that high capillary performance is presented. Holes of different sizes provide a large number of bubble nucleation sites and bubble separation paths respectively, meanwhile, a hole-shaped structure directly communicated with a substrate enables two-phase heat exchange to occur in a position closer to the substrate so as to obtain a smaller wall surface superheat degree, and a liquid working medium is continuously supplemented due to the high capillary liquid absorption characteristic of the hole-shaped structure. The drying of the surface caused by high heat flux is reduced, and the film-like boiling is delayed, so that the heat transfer of the boiling surface is further enhanced.

Description

technical field [0001] The invention belongs to the field of material science, and in particular relates to a porous structure surface with high capillary performance and high boiling heat transfer performance and a preparation method thereof. Background technique [0002] In order to solve the heat dissipation problem of the equipment, the two-phase heat transfer device is an efficient solution, and the liquid absorbent core is an important part of the two-phase heat transfer device. On the one hand, the stable circulation of the liquid working medium in the chamber is realized through the capillary force of the liquid-absorbing core structure; on the other hand, the working fluid boils on the surface of the liquid-absorbing core structure, so the capillary performance and boiling heat transfer performance of the liquid-absorbing core directly affect The overall heat transfer capability of a phase heat transfer device. Most of the traditional liquid-absorbing core structur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D5/34C25D5/50C25D3/38F28D15/04
CPCC25D5/623C25D5/617C25D5/34C25D5/50C25D3/38F28D15/046
Inventor 吕树申黄林曾慧徐谋罗佳利莫冬传
Owner SUN YAT SEN UNIV
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