The invention relates to the technical field of display screen packaging, in particular to a full-lamination packaging process and dispensing equipment for a COB integrated packaging
LED display screen, and the full-lamination packaging process comprises the steps: placing a COB substrate after
die bonding into a cavity, and obtaining three-dimensional topological data and environmental parameters of a
chip array; executing multi-stage gradient air exhaust and applying dual-frequency ultrasonic pretreatment, activating
surface energy and removing adsorbed gas; in a
vacuum state, dispensing is carried out based on three-dimensional data, a
colloid volume expansion rate and a
bubble nucleation critical
pressure difference threshold value are calculated in real time by utilizing a dynamic rheological pressure
coupling model, dispensing pressure and speed are dynamically and reversely compensated, and it is ensured that
colloid tensile stress is lower than a critical value; the in-situ optical detection unit is used for scanning and recognizing micron-sized bubbles or missing in real time, and the Z-axis height and the glue output amount of a subsequent dispensing path are fed back and corrected; and finally, a nonlinear variable-
voltage oscillation program is executed to induce micro-bubble
resonance fracture and solidification, so that the bubble defect in the packaging process is effectively eliminated, and the product yield is improved.