The invention relates to an enhanced heat exchange surface with a
composite structure and a
chip heat dissipation structure, the enhanced heat exchange surface comprises a bottom plate, a
metal frame, bubble escape holes and a
porous medium, the bottom plate and the
metal frame are of an integrated structure, the
porous medium is arranged on the upper surface of the bottom plate, and the
porous medium filled in the frame is provided with the bubble escape holes; the
chip heat dissipation structure comprises a first cover plate, a first radiator connector, a bottom plate and an enhanced heat exchange surface arranged on the upper surface of the bottom plate, the bottom plate is tightly connected with the first cover plate, the first cover plate is provided with a fixed installation hole so that the bottom face of the bottom plate can be tightly attached to the
chip through a connecting structure, and a heat exchange cavity is formed between the first cover plate and the enhanced heat exchange surface. Compared with the prior art, the enhanced heat exchange surface compounded by multiple structures is designed, the synergistic effect of rapid
bubble nucleation and directional bubble escape is achieved, the
critical heat flux density and the
heat transfer coefficient can be improved at the same time, the chip is effectively prevented from
underclocking due to overheating, and stable operation of the chip under
high load is ensured.