Boiling enhanced heat exchange structure of chips and fabrication method thereof

Abstract

The invention relates to a high heat flux density boiling enhanced heat exchange technology, in particular to amicroelectronic chip high efficiency cooling technology with a high heat flux density, particularly the boiling enhanced heat exchange structure of chips and the fabrication method thereof, which is characterized in that a plurality of lug bosses with a column structure are corroded on the surface of a chip; a SiO2 layer is splashed on the surface of the chip with the lug bosses; and the SiO2 layer is corroded to form a porous structure. The boiling enhanced heat exchange structure of chips can provide sufficient bubble nucleation number and a larger effective heat exchange area under the circumstance of a lower wall surface superheat degree, thereby solving the problem that the thermal shock of the chip exists from incipient boiling to nucleate boiling, and meanwhile, improving critical heat flux density remarkably to ensure the effective heat exchange of a high heat flux density electronic device.

Description

technical field [0001] The invention relates to a high heat flux boiling enhanced heat transfer technology, in particular to a high heat flux density microelectronic chip efficient cooling technology, specifically a chip boiling enhanced heat transfer structure and a manufacturing method thereof. Background technique [0002] With the rapid development of microelectronics technology, electronic products tend to develop in the direction of high performance, portability and miniaturization. The continuous reduction of the feature size of electronic devices and the continuous improvement of chip integration and circuit operating frequency have led to a rapid increase in chip heat flux, which has become the primary problem restricting the development of highly integrated chip technology. It is estimated that in the near future, the heat flux density of the chip can be as high as 10 2 W / cm 2 Above, if the heat generated is not dissipated in time, the temperature of the chip wil...

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Problems solved by technology

From the beginning of boiling to the state of critical heat flux, the temperature of the heating surface hardly increases with the increase of heat flux, which makes up for the deficiency of the surface microstructure developed by previous researchers, but there are the following problems: one is that it takes a long time for boiling to start. High wall superheat, and second, there is an obvious temperature jump process from the beginning of boiling to nucleate boiling heat transfer, resulting in thermal shock to the chip

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