Composite microcavity porous curved-surface microchannel structure for liquid film boiling and preparation method thereof

A technology of micro-channel structure and porous surface, applied in the field of heat transfer, can solve problems such as reducing heat transfer coefficient, and achieve the effects of enhancing heat transfer performance, simple manufacturing process and low cost

Active Publication Date: 2021-08-10
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the flow of heat from the solid surface through the saturated capillary structure increases the thermal resistance before evaporation and thus reduces the heat transfer coefficient (HTC)
Clearly, capillary evaporation is affected by the trade-off between the high wicking flow rate required for the liquid supply and the low ther

Method used

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  • Composite microcavity porous curved-surface microchannel structure for liquid film boiling and preparation method thereof
  • Composite microcavity porous curved-surface microchannel structure for liquid film boiling and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0044] A method for preparing a compound microcavity porous surface microchannel structure for liquid film boiling with enhanced heat transfer capability, comprising the following steps:

[0045] Step 1: Take an appropriate amount of sodium chloride particles, grind and sieve to obtain a pore-forming agent with a particle size of 15-20 μm, and dry it for later use;

[0046] Step 2: At room temperature, mix the spherical copper powder with a particle size of 50-75 μm and the pore-forming agent at a volume ratio of 4:6, and put them into a ball mill for ball milling to obtain a mixture of copper powder and pore-forming agent ;

[0047] Step 3: First put the graphite mold into the graphite shaping chamber, and then carefully fill the mixture of copper powder and sodium chloride. When the filling height of the mixture of copper powder and sodium chloride is 0.5mm higher than the mold, fill the copper powder The substrate is covered on the surface of the mixture of copper powder a...

Embodiment 2

[0053] A method for preparing a compound microcavity porous surface microchannel structure for liquid film boiling with enhanced heat transfer capability, comprising the following steps:

[0054] Step 1: Take an appropriate amount of sodium chloride particles, grind and sieve to obtain a pore-forming agent with a particle size of 15-20 μm, and dry it for later use;

[0055] Step 2: At room temperature, respectively mix the spherical copper powders of 50-75 μm, 75-100 μm and 100-150 μm according to the volume ratio of 1:1:1 and continue to mix with the pore-forming agent according to the volume ratio of 4:6, Put them together in a ball mill for ball milling and mixing to obtain a mixture of copper powder and pore-forming agent;

[0056] Step 3: First put the graphite mold into the graphite shaping chamber, and then carefully fill the mixture of copper powder and sodium chloride. When the filling height of the mixture of copper powder and sodium chloride is 0.5mm higher than the...

Embodiment 3

[0062] A method for preparing a compound microcavity porous surface microchannel structure for liquid film boiling with enhanced heat transfer capability, comprising the following steps:

[0063] Step 1: First put the graphite mold into the graphite shaping chamber, and then carefully fill the spherical copper powder of 50-75μm. When the filling height of the copper powder is 0.5mm higher than the mold, cover the copper substrate on the surface of the copper powder. Then seal it with a cover (such as figure 1 shown), and finally apply a certain pressure with the fixture to clamp up and down, so that the copper powder is compacted and in close contact with the copper substrate;

[0064] Step 3: Put the mold into a vacuum furnace for vacuum sintering, the sintering temperature is 900°C, the sintering time is 40 minutes, and then naturally cool to room temperature to obtain a sintered copper powder block;

[0065] Step 4: Ultrasonic cleaning the sintered copper powder block with...

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Abstract

The invention provides a composite microcavity porous curved-surface microchannel structure for liquid film boiling and a preparation method thereof, and the preparation method comprises the following steps: carrying out compression molding on sodium chloride pore-forming agent particles and copper powder, or directly carrying out loose sintering on the copper powder, carrying out laying, combining, sintering, cleaning to remove the pore-forming agent, carrying out oxidation etching, and carrying out chemical cleaning to obtain the composite microcavity porous curved-surface microchannel structure. The composite micro-cavity porous curved surface micro-channel structure prepared by the preparation method disclosed by the invention is coupled with the advantages of high permeability between micro-columns and high capillary pressure between copper powder, and has good capillary performance; the micro-cavity structure on the surface of the copper powder increases the bubble nucleation density and the super-hydrophilic wettability and can delay CHF under high heat flux, the double-curved-surface structure design increases the pinning effect of liquid film spreading, the area of a thin liquid film near a three-phase contact line can be increased, and therefore the heat transfer area is increased, and the heat transfer performance is enhanced.

Description

technical field [0001] The invention relates to the technical field of heat transfer, in particular to a composite microcavity porous curved surface microchannel structure for liquid film boiling and a preparation method thereof. Background technique [0002] Power electronics have become an important part of low- to high-voltage electrical equipment, including portable electronics, photovoltaic cell inverters, light-emitting diodes (LEDs), and electric vehicles. With the rapid development of emerging technologies, there are two major trends of miniaturization and integration, accompanied by a sharp increase in heat flux. The development of emerging materials, such as silicon carbide and gallium nitride, enable smaller and more compact devices with higher power density, which requires more effective thermal management technology to match ultra-thin heat dissipation devices. The challenges of thermal management technology mainly come from the layout and spatial distribution ...

Claims

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Application Information

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IPC IPC(8): B01D1/22
CPCB01D1/22
Inventor 兰忠李启凡温荣福马学虎刘嘉琦徐灿王建新
Owner DALIAN UNIV OF TECH
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