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Manufacturing method for microchannel heat exchange plate with multi-scale surface structure character

A technology of surface structure and manufacturing method, applied in the field of manufacturing microchannel heat exchange plates, can solve the problems of high cost, complex lithography, high requirements, etc., and achieve the effects of low production cost, simple processing technology and low equipment requirements

Active Publication Date: 2018-08-03
XIAMEN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing microchannel structure manufacturing technologies are based on complex and demanding processes such as photolithography, and the cost is high

Method used

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  • Manufacturing method for microchannel heat exchange plate with multi-scale surface structure character
  • Manufacturing method for microchannel heat exchange plate with multi-scale surface structure character
  • Manufacturing method for microchannel heat exchange plate with multi-scale surface structure character

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0028] refer to figure 1 and figure 2 , a microchannel heat exchange plate with multi-scale surface structure features includes an upper cover plate 3, an upper sealing plate 2, two metal substrates 1, a lower sealing plate 5 and a lower cover plate 6, which are stacked sequentially from top to bottom. The substrate 1 is provided with arrayed microchannels 11 with micron-scale features and micro-nano surface structures 12 with smaller bottom scales. Among them, the microchannels 11 are arranged in parallel at equidistant intervals, the interval is 0.4-1.0mm, the width range of each microchannel 11 is 0.2-0.8mm, and the height range is 0.5-2mm; the micro-nano surface structure 12 has regular unevenness, the height 200-500nm. Its preparation method comprises the following steps:

[0029] (1) Use a multi-tooth saw blade milling cutter combination tool to process an arrayed microchannel 11 with micron-scale features on the metal substrate 1 through an ordinary milling machine;...

Embodiment 1

[0033] Provide a red copper plate as the metal substrate 1, and form an array of microchannels 11 on the red copper plate through the above-mentioned multi-tooth saw blade milling cutter combination tool. These microchannels are parallel to each other, with a width range of 0.8mm, a height range of 1mm, and an interval of 0.6mm .

[0034] Using laser processing, the laser wavelength is 1064nm, the average output power of the laser is 30W, the processing speed is 1000mm / s, the number of laser scans for a single microstructure is 30 times, the scanning distance is greater than 0.1mm and the processing path is zigzag scanning , forming a matrix array of nanopillars 12a at the bottom of each microchannel, the interval between adjacent nanopillars is 0.5mm; each nanopillar is a cylinder with a cross-sectional area of ​​0.2mm 2 . The obtained copper plate structure with multi-scale surface structure features is as follows: image 3 and Figure 4 shown.

[0035] The microchannel ...

Embodiment 2

[0037]Provide a red copper plate, form the arrayed microchannel 11 by the mode of embodiment 1, adopt the mode of laser processing, laser wavelength is 1064nm, the average output power of laser is 30W, processing speed is 1000mm / s, the number of times of laser scan of single microstructure is 30 times, the scanning distance is less than or equal to 0.1mm and the processing path is "back" scanning, forming a matrix-like array of nanopillars 12b at the bottom of each microchannel, the interval between adjacent nanopillars is 0.5mm, and each nanopillar is a cone structure, the bottom area of ​​the cone is 0.2mm 2 . The obtained copper plate structure with multi-scale surface structure features is as follows: Figure 5 shown. The microchannel array structure with multi-scale surface structure features in this embodiment can effectively increase the nucleation points of bubbles, enhance disturbance, and enhance heat transfer.

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Abstract

The invention discloses a manufacturing method for a microchannel heat exchange plate with a multi-scale surface structure character. Firstly, a multi-tooth saw web milling cutter combined cutter is used for machining array type microchannel structures with the micrometer scale character in metal base plates; then, smaller micro-nano surface structures with different structure shapes are machinedin the bottoms of microchannels in a laser machining manner, and then the array type microchannel structures and the micro-nano surface structures are packaged to sealing plates and cover plates, anda microchannel heat exchange plate is obtained. By utilization of the machining method, micro-nano composite structures are generated in the microchannels, bubble nucleation points can be effectivelyincreased, the effective heat exchange area is increased, a flow pattern structure is improved, and accordingly the purposes of enhancing boiling heat exchange and improving the microchannel heat transfer coefficient are achieved. Meanwhile, the machining method has the beneficial effects that the equipment requirement is low, the machining technology is simple, and the production cost is low. Themicrochannel array structure, with the multi-scale surface structure character, studied in the manufacturing method has wide application prospects in the electronic equipment heat dissipation field.

Description

technical field [0001] The invention belongs to the technical field of microchannel manufacturing and heat exchange, and in particular relates to a method for manufacturing a microchannel heat exchange plate with multi-scale surface structure features. Background technique [0002] In recent years, with the development of modern electronic technology, micro-electro-mechanical systems, ultra-large-scale integrated circuits and other technologies have made electronic equipment develop rapidly in the direction of high speed, multi-function, high power, and miniaturization. The assembly density of electronic equipment is getting higher and higher, and high-density assembly technology is widely used in various electronic equipment such as power devices (such as IGBTs), smart wearable devices, handheld computers, military airborne computers, and aerospace vehicles. In these electronic devices, the rapidly increasing heat generation of chip systems has become a major challenge in t...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 周伟周芳刘韶宇邱清富俞炜刘阳旭
Owner XIAMEN UNIV
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