Low-temperature self-drying low-VOC (volatile organic compound) camouflage functional heat-insulating and cooling coating as well as preparation
A technology of heat insulation, cooling and self-drying, applied in camouflage coatings, epoxy resin coatings, reflective/signal coatings, etc., can solve the problems of affecting efficiency, low heat insulation efficiency, excessive organic volatiles, etc., and achieve good heat insulation. The effect of cooling effect
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Embodiment 1
[0041] The first step: Silicone modified epoxy resin, some high-purity xylene, propylene glycol methyl ether, and n-butanol solvents are dispersed for 15-30 minutes at a speed of 500RPM-800RPM; silicone modified epoxy resin is silicone Organosilicon-modified bisphenol-A epoxy resin with a content of 15% and a molecular weight of 2500;
[0042] Step 2: After the first step of dispersion, increase the speed to 1000RPM-1500RPM and add polyether modified silicone leveling agent, polydimethylsilicon defoamer and titanium dioxide while dispersing, disperse at high speed for 30-60min, and test Fineness<20 microns;
[0043] Step 3: Reduce the dispersion speed to 300RPM-500RPM, add airgel particle size 10um, void diameter 20nm; and hollow glass microspheres particle size 60-70um, disperse for 30-45min, then Add the drier and the remaining part of the solvent while dispersing, and disperse for 30-45 minutes, filter and pack with a 70-mesh filter, and it is component A of the heat-insul...
Embodiment 2
[0048] The first step: Silicone modified epoxy resin, part of trimethylbenzene, isopropanol, propylene glycol methyl ether acetate at the speed of 500RPM-800RPM, disperse for 15-30min; silicone modified epoxy resin is the silicone content 20% silicone-modified bisphenol-A epoxy resin with a molecular weight of 3500;
[0049] Step 2: After the first step of dispersion, increase the speed to 1000RPM-1500RPM and add polyether modified silicone leveling agent, polydimethylsilicon defoamer and titanium dioxide while dispersing, disperse at high speed for 30-60min, and test Fineness<20 microns;
[0050] Step 3: Reduce the dispersion speed to 300RPM-500RPM, add hollow glass microspheres with airgel particle size of 10um, void diameter of 40nm and particle size of 80-100 microns while dispersing, disperse for 30-45min, and then disperse While adding the drier and the remaining part of the solvent, disperse for 30-45 minutes, filter the package with a 70-mesh filter, and use it as com...
Embodiment 3
[0055] The first step: silicone modified epoxy resin, part of xylene, trimethylbenzene, propylene glycol methyl ether at a speed of 500RPM-800RPM, disperse for 15-30min; silicone modified epoxy resin is silicone content of 30% , a silicone-modified bisphenol F epoxy resin with a molecular weight of 5000;
[0056] Step 2: After the first step of dispersing, increase the speed to 1000RPM-1500RPM and add polyester modified silicone leveling agent, polydimethylsilicon defoamer and titanium dioxide while dispersing, disperse at high speed for 30-60min, and test Fineness<20 microns;
[0057] Step 3: Reduce the dispersing speed to 300RPM-500RPM, add hollow ceramic microspheres with airgel particle size of 20um, void diameter of 50nm and particle size of 100-120 microns while dispersing, disperse for 30-45min, and then disperse While adding the drier and the remaining part of the solvent, disperse for 30-45 minutes, filter the package with a 70-mesh filter, and use it as component A ...
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