Aluminum-based copper-clad plate with high breakdown voltage and production process thereof

A technology of aluminum-based copper-clad laminates and high breakdown voltage, which is applied in lamination, layered products, printed circuits, etc., can solve problems such as slow release, aluminum-based copper-clad laminate warping, and greater impact on production efficiency, and achieve improved Effects of breakdown voltage, release of shrinkage stress, and improvement of peel strength

Pending Publication Date: 2022-06-24
江西鑫远基电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aluminum-based copper-clad laminates have the advantages of good heat dissipation performance, but they also have the following defects: 1. Since the aluminum base material is a rigid material, the insulating adhesive layer after copper clad is pressed and formed, due to the difference in thermal expansion coefficient of the three-layer structure Larger, it will lead to greater internal stress of the aluminum-based copper-clad laminate, causing the aluminum-based copper-clad laminate to warp and form a substandard product; 2. Since the surface of the copper foil is not an ideal smooth plane, but has burrs, the aluminum-based copper-clad laminate When doing the breakdown voltage voltage test, the burr is easy to form a tip discharge, which affects the breakdown voltage of the aluminum-based copper clad laminate and the working stability of the subsequent PCB production
[0004] In the prior art, for the above-mentioned first defect, the main method is to maintain the pressing pressure after pressing and then slowly lower the temperature to slowly release the internal stress to prevent the aluminum-based copper clad laminate from warping, but it has a great impact on production efficiency ;Aiming at the second defect above, there are various technological solutions: such as using an insulating adhesive layer with better electrical insulation performance, adding insulating fillers to the insulating adhesive layer, etc., because the aluminum-based copper-clad laminate should not be too thick, so The process of increasing the thickness of the insulating bonding layer is rarely used

Method used

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  • Aluminum-based copper-clad plate with high breakdown voltage and production process thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A production process of a high breakdown voltage aluminum-based copper clad laminate, the production process is as follows:

[0033] (1) Preparation of insulating glue:

[0034] 50 parts of epoxy resin, 15 parts of isocyanate modified epoxy resin, 15 parts of rubber modified epoxy resin, 5 parts of isobornyl methacrylate, 0.1 part of curing agent, and 0.01 part of methylhydroquinone; the curing agent is: 2-methylimidazole: the Vicbase TC3635 mass ratio is a mixed curing agent of 5:1; according to the above-mentioned mass parts, insulating adhesive is obtained;

[0035] (2) Preparation of semi-cured layer

[0036] Coating the insulating adhesive on the copper foil, heating the copper foil to 90℃ to semi-curing the insulating adhesive to form a semi-curing layer;

[0037] At the same time, 0.2% of the modified lightweight insulating nano-fine powder was added to the insulating adhesive, then coated on the aluminum substrate, and the aluminum substrate was heated to 90°C...

Embodiment 2

[0047] A production process of a high breakdown voltage aluminum-based copper clad laminate, the production process is as follows:

[0048] (1) Preparation of insulating glue:

[0049] 55 parts of epoxy resin, 12 parts of isocyanate modified epoxy resin, 18 parts of rubber modified epoxy resin, 9 parts of tert-butyl cyclohexyl methacrylate, 0.2 part of curing agent, 0.02 part of methylhydroquinone; the curing agent Be 2-ethyl-4-methylimidazole: Vicbase TC3635 mass ratio is the mixed curing agent of 4:1; According to above-mentioned mass parts, make insulating glue;

[0050] (2) Preparation of semi-cured layer

[0051] Coating the insulating adhesive on the copper foil, heating the copper foil to 92°C to semi-curing the insulating adhesive to form a semi-cured layer;

[0052] At the same time, the modified lightweight insulating nano-fine powder with a mass fraction of 0.3% was added to the insulating adhesive, and then coated on the aluminum substrate, and the aluminum subst...

Embodiment 3

[0062] A production process of a high breakdown voltage aluminum-based copper clad laminate, the production process is as follows:

[0063] (1) Preparation of insulating glue:

[0064] 60 parts of epoxy resin, 10 parts of isocyanate modified epoxy resin, 20 parts of rubber modified epoxy resin, 10 parts of tetrahydrofuran methacrylate, 0.3 part of curing agent, 0.03 part of methylhydroquinone; the curing agent is 2 -Phenylimidazole: the VicbaseTC3635 mass ratio is a mixed curing agent of 4:1; according to the above-mentioned mass parts, insulating adhesive is obtained;

[0065] (2) Preparation of semi-cured layer

[0066] Coating the insulating adhesive on the copper foil, heating the copper foil to 100℃ to semi-curing the insulating adhesive to form a semi-curing layer;

[0067] At the same time, the modified lightweight insulating nano-fine powder with a mass fraction of 0.5% is added to the insulating adhesive, and then coated on the aluminum substrate, and the aluminum s...

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Abstract

According to the aluminum-based copper-clad plate with the high breakdown voltage and the production process thereof, by adjusting the formula of the insulating bonding layer and the press-fit forming process, the insulating bonding layer has the post-curing performance, the bonding performance is guaranteed, meanwhile, internal stress can be effectively released, the production efficiency is improved, and the service life of the aluminum-based copper-clad plate is prolonged. And meanwhile, the breakdown voltage of the aluminum-based copper-clad plate can be greatly improved.

Description

technical field [0001] The invention relates to a production process of an aluminum-based copper-clad laminate, in particular to an aluminum-based copper-clad laminate with high breakdown voltage and a production process thereof. Background technique [0002] Aluminum-based copper clad laminate is the most important raw material for the preparation of PCB. It is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin or single resin as an insulating adhesive layer, and one or both sides are covered with copper foil and made by hot pressing. It is a kind of plate-like material, and its structure is usually composed of three-layer structure of copper foil, insulating adhesive layer and aluminum plate. Due to the good thermal conductivity of aluminum-based copper clad laminates, it is more and more widely used in PCB production. [0003] The thickness of the aluminum base of the common aluminum-based copper clad laminate is about 0.6-3.0mm, w...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B32B15/01B32B15/20B32B7/12B32B33/00B32B37/12B32B37/06B32B37/10B32B37/00B32B38/00C09J4/06C09J4/02H05K3/00H05K3/02H05K1/02
CPCB32B15/017B32B7/12B32B33/00B32B37/1284B32B37/06B32B37/1018B32B37/00B32B38/0036C09J4/06H05K3/00H05K3/022H05K1/02B32B2038/0076B32B2307/206B32B2037/243B32B2255/06B32B2255/26B32B2457/08Y02E60/10
Inventor邓飞邓后胜
Owner江西鑫远基电子科技有限公司