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Low-dielectric cooling fin and preparation method thereof

A technology of heat sink and heat dissipation layer, which is applied in chemical instruments and methods, structural parts of electrical equipment, flat products, etc., can solve the problems of harsh process conditions, low heat dissipation characteristics, low dielectric characteristics, etc., and achieve low dielectric characteristics Excellent, excellent heat dissipation effect, high productivity effect

Pending Publication Date: 2022-07-01
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the process of preparing a heat sink in a C-stage state with a roll shape, if it is produced by the previously mentioned production method, the densification of the heat sink will not be sufficient, not only that, but there will be low dielectric properties or heat dissipation properties low problem
[0009] In addition, in the current industry, materials such as heat sinks are produced by using a hot stamping process with a relatively low process difficulty. However, although the hot stamping process has a low process difficulty, there is a problem that it takes a long time to prepare heat sinks.
[0010] However, in the case of producing a heat sink using a process other than the hot stamping process, there is a problem that the process conditions are very severe especially in the production of a heat dissipation layer containing particles for imparting low dielectric properties.

Method used

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  • Low-dielectric cooling fin and preparation method thereof
  • Low-dielectric cooling fin and preparation method thereof
  • Low-dielectric cooling fin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0051] Preparation method of heat sink

[0052] like figure 1The heat sink in the form shown can be produced by the following method.

[0053] The execution process includes: a first step, preparing a heat sink; a second step, applying tension along the longitudinal direction of the heat sink, and may further include: a third step, performing heat treatment.

[0054] First, in the first step, a liquid preparation liquid can be prepared by dispersing the ceramic particle powder in the polymer resin, and after the prepared liquid preparation liquid is applied to one side of the protective film layer 10, the applied liquid preparation liquid is The preparation liquid is partially cured (or dried), and the heat dissipation layer 20 is formed on the upper portion of the protective film layer 10 to prepare a heat dissipation sheet. In this case, the above-mentioned heat dissipation layer is in a B-stage state.

[0055] In addition, a heat dissipation sheet can be prepared by form...

Embodiment 1

[0075] 1. Example 1: Preparation of heat sink with two-layer structure

[0076] (1) Prepare a polyethylene terephthalate film (protective film layer) with an adhesive layer formed on one side using an acrylic adhesive, and prepare to laminate on the upper part of the adhesive layer of the protective film layer Heat dissipation layer in B-stage state (polymer layer formed from a preparation liquid containing urethane resin and epoxy resin containing ceramic particles (including boron nitride and alumina ceramic particles) as main resins) The two-layer structure of the heat sink. (For reference, the two-layer structure here refers to a two-layer structure of a protective film layer and a heat dissipation layer.)

[0077] The above-mentioned heat dissipation layer contains ceramic particles.

[0078] (2) through the image 3 The above-mentioned heat sink is prepared in the process shown in the schematic diagram.

[0079] Specifically, the prepared above-mentioned heat sink pa...

Embodiment 2～ Embodiment 5

[0082] 2. Example 2 to Example 5 and Comparative Example 1 to Comparative Example 6

[0083] Two-layer fins were prepared in the same manner as in Example 1 above, but the braking ratios of the brake rollers were adjusted as shown in Table 1, and the respective fins were prepared by applying different tensions. .

[0084] Table 1

[0085]

[0086] Looking at the experimental results in Table 1 above, in Examples 1 to 5, it was confirmed that a heat sink having an appropriate thickness was effectively prepared.

[0087] On the contrary, in Comparative Example 1 in which the second tension exceeded 400 kgf / cm, the fins could not be prepared due to the occurrence of a slip phenomenon.

[0088] Furthermore, in Comparative Example 2 where the first tension exceeded 160 kgf / cm, a vibration problem occurred during the process, and in Comparative Example 3 where the first tension was less than 80 kgf / cm, there was a problem of slippage during the process.

[0089] In addition, in ...

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Abstract

The present invention relates to a heat sink, and more particularly, to a method for manufacturing a heat sink with high productivity, and a heat sink manufactured by the method and having excellent heat dissipation efficiency and low dielectric characteristics.

Description

technical field [0001] The present invention relates to a heat sink, and more particularly, to a heat sink having high density through tension adjustment and making the low dielectric properties remarkably excellent, and a preparation method thereof. Background technique [0002] Recently, with the improvement in performance, thickness and size of electrical and electronic equipment, there has been an increasing demand for heat sinks that can efficiently dissipate heat generated from heat sources such as semiconductor components and light-emitting components incorporated in electrical and electronic equipment, and demand Equipped with electromagnetic wave shielding compound function. [0003] Conventional heat sinks generally use fillers of metal materials, and most of them are materials with a high dielectric constant having a dielectric constant of 4 F / m or more, which leads to an increase in the dielectric constant of the heat sink. [0004] Even if such a conventional h...

Claims

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Application Information

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IPC IPC(8): B29C65/52C09J7/25C09J7/29C09J7/40B29L7/00
CPCB29C65/48B29C66/45B29C66/034C09J7/25C09J7/40C09J7/29C09J2301/122C09J2301/16C09J2203/326B29L2007/002C08J7/04B32B27/08B32B27/18B32B7/06C09J7/22H05K7/20481
Inventor 柳泰铉尹贤优朴民祐朴德夏
Owner INNOX ADVANCED MATERIALS CO LTD