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Organic fiber paper-based metal foil-clad laminated board as well as preparation method and application thereof

An organic fiber and metal-clad technology, which is applied in the field of organic fiber paper-based metal-clad laminates and its preparation, can solve the problem that the dielectric properties, stability and reliability of copper-clad laminates are difficult to meet the application requirements of high-performance electronic equipment, prepreg The comprehensive performance of the material is not good, the thickness of the resin is not easy to control, etc., and the preparation process is convenient and controllable, the controllability is good, and the effect of meeting the performance requirements is achieved.

Pending Publication Date: 2022-07-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since aramid paper has a porous and fluffy structure and has a strong ability to absorb glue, it absorbs a large amount of glue in the process of impregnating glue, making it difficult to control the thickness of the resin, especially difficult to obtain a lower thickness; secondly, aramid paper After the paper is impregnated with glue, the strength will decrease obviously, and it is easy to break during the gluing process, resulting in difficulties in production and a decline in the pass rate; the above-mentioned problem of gluing and gluing is also a common problem faced by paper-based prepregs and copper-clad laminates.
At the same time, due to the defects in the preparation process of the prepreg, the overall performance of the prepreg is not good, and the copper-clad laminate prepared from this is difficult to meet the application requirements of high-performance electronic devices in terms of dielectric properties, stability and reliability.

Method used

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  • Organic fiber paper-based metal foil-clad laminated board as well as preparation method and application thereof
  • Organic fiber paper-based metal foil-clad laminated board as well as preparation method and application thereof
  • Organic fiber paper-based metal foil-clad laminated board as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] An organic fiber paper-based metal foil-clad laminate, comprising an insulating material and copper foils arranged on both sides of the insulating material, and the thickness of the copper foil is 18 μm; the insulating material includes two resin layers (epoxy resin layers) , the thickness of the resin layer is 50μm; the aramid paper is arranged between the two resin layers, the thickness of the aramid paper is 100μm, and the unit weight is 68g / m 2 ; Its structure diagram is as follows figure 1 As shown, among them, 1-copper foil, 2-resin layer, 3-organic fiber paper, is aramid paper.

[0067] The preparation method of the organic fiber paper-based metal foil-clad laminate is as follows:

[0068] (1) Mix epoxy resin (DER593 of DOW Chemical) and phenolic resin (KPH-F2004 of Kelon Company) with the equivalent ratio of epoxy equivalent to hydroxyl equivalent of 1:1, add an appropriate amount of solvent (butanone), stir 4h, the resin glue solution is obtained, and the gel...

Embodiment 2

[0074] An organic fiber paper-based metal foil-clad laminate, comprising an insulating material and copper foils arranged on both sides of the insulating material, and the thickness of the copper foil is 18 μm; the insulating material includes two resin layers (epoxy resin layers) , the thickness of the resin layer is 30μm; the aramid paper is arranged between the two resin layers, the thickness of the aramid paper is 50μm, and the unit weight is 34g / m 2 , the schematic diagram of its structure is the same as that in Example 1.

[0075] The preparation method of the organic fiber paper-based metal foil-clad laminate is as follows:

[0076] (1) Coating resin glue on the copper foil (the preparation method is the same as that of Example 1), placing it in an oven at 130° C. for 4 min to remove the solvent, and obtaining resin-coated copper foil (RCC);

[0077] (2) Laminate alternately the resin-coated copper foil and aramid paper obtained in step (1), and the stacking sequence i...

Embodiment 3

[0081] An organic fiber paper-based metal-clad laminate, comprising an insulating material and copper foils arranged on both sides of the insulating material, and the thickness of the copper foil is 35 μm; the insulating material includes two resin layers (epoxy resin layers) , the thickness of the resin layer is 20μm; the aramid paper is arranged between the two resin layers, the thickness of the aramid paper is 25μm, and the unit weight is 17g / m 2 , the schematic diagram of its structure is the same as that in Example 1.

[0082] The preparation method of the organic fiber paper-based metal foil-clad laminate is as follows:

[0083] (1) Epoxy resin (TX-1467 of Nippon Steel Corporation and 530A80 of DOW Chemical Co., Ltd. are used in a mass ratio of 8:2) and phenolic resin (PHL6635 of Hansen Corporation) with epoxy equivalent and hydroxyl equivalent. The equivalence ratio is 1:0.95 for mixing, adding an appropriate amount of solvent (butanone) and stirring for 4 hours to obt...

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Abstract

The invention provides an organic fiber paper-based metal foil-coated laminated board as well as a preparation method and application thereof. The organic fiber paper-based metal foil-coated laminated board comprises an insulating material and metal foils arranged on one side or two sides of the insulating material, the insulating material comprises at least two resin layers, and a layer of organic fiber paper is arranged between any two adjacent resin layers. Through the structural arrangement that the organic fiber paper and the resin layers are alternately stacked, dipping and gluing are not needed, the thickness and performance of the insulating material and the dielectric layer are controllable, and the dimensional stability and reliability of the organic fiber paper-based metal foil-clad laminated board are remarkably improved. The organic fiber paper-based metal foil-coated laminated board is low in dielectric constant, dielectric loss, thermal expansion coefficient and radioactivity and high in thermal stability, and can fully meet the application requirements of high-performance circuit substrates.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to an organic fiber paper-based metal foil-clad laminate and a preparation method and application thereof. Background technique [0002] In recent years, with the rapid development of information technology, all kinds of electronic consumer goods with high-speed information processing functions have become an indispensable key part of daily life. Wireless communication and broadband technology have gradually become popular in the field of civil consumer electronics. During this period, the core of electronic information communication technology will be to develop in the direction of high frequency and high speed. As one of the important components of electronic products, printed circuit boards are required to match the high-frequency development of electronic communication technology. Metal-clad laminate is a substrate for preparing printed circuit boards...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/092B32B27/38B32B29/00B32B27/10B32B37/06B32B37/10B32B15/12B32B37/24B32B38/16C08L63/00C08L61/06C08L23/00C08J5/18H05K1/03
CPCB32B15/20B32B15/092B32B27/38B32B29/00B32B27/10B32B37/06B32B37/10B32B15/12B32B37/24B32B38/164C08J5/18H05K1/0366H05K1/036B32B2037/243B32B2038/168B32B2255/06B32B2255/26B32B2307/306B32B2307/734B32B2457/08C08J2363/00C08J2361/06C08J2461/06C08J2323/00
Inventor 刘东亮
Owner GUANGDONG SHENGYI SCI TECH