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Polyimide film with synergistic cross-linked structure as well as preparation method and application of polyimide film

A technology of polyimide film and cross-linked structure, applied in identification devices, instruments and other directions, can solve the problems of poor thermal stability and large thermal expansion coefficient of polyimide, and achieves simple preparation method, reduced CTE, and improved vitrification. Effect of transition temperature

Pending Publication Date: 2022-07-01
SHANGHAI PLASTICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, compared with inorganic materials, polyimide has poor thermal stability, mainly reflected in the large coefficient of thermal expansion (CTE), which will cause warping, cracking or delamination with inorganic substrates during the manufacturing process of display substrates. , the flexible display also has high requirements on the flexibility of the backplane, and the polyimide film must have good bending resistance at the same time

Method used

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  • Polyimide film with synergistic cross-linked structure as well as preparation method and application of polyimide film
  • Polyimide film with synergistic cross-linked structure as well as preparation method and application of polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] This example realizes the preparation of polyimide film with synergistic cross-linked structure in the following ways:

[0028] 1. In the reactor, add solvent N-methylpyrrolidone 261.13g, turn on mechanical stirring, add diamine compound 3,5-diaminobenzoic acid 1.11g and p-phenylenediamine 12.38g, control temperature to 30℃, Stir for 30min, add dianhydride compound 3,3'4,4'-biphenyltetracarboxylic dianhydride 35.31g after complete dissolution, the viscosity of the reaction solution gradually increases, after 6 hours of reaction, it is heated to 50 ℃, and after 3 hours of reaction , lowered to 25° C., added 0.94 g of end-capped compound trimellitic anhydride, reacted for 5 hours, stopped stirring, and obtained a polyamic acid solution with an apparent viscosity of 6000 cps.

[0029] 2. Use a filter membrane with a pore size of 0.3 μm to filter the polyamic acid solution obtained in step 1 through positive pressure. After vacuum defoaming, it is uniformly coated on a clea...

Embodiment 2

[0031] 1. In the reactor, add the solvent N-methylpyrrolidone 312.72g, turn on the mechanical stirring, then add the diamine compound 3,5-diaminobenzoic acid 1.81g and p-phenylenediamine 20.16g, control the temperature to 30 ℃, Stir for 30min, add dianhydride compound 3,3'4,4'-biphenyltetracarboxylic dianhydride 35.31g and pyromellitic dianhydride 15.79g after completely dissolving, the viscosity of the reaction solution gradually increases, after 6 hours of reaction, The temperature was raised to 50°C, and after 3 hours of reaction, the temperature was lowered to 25°C, and 2.29 g of end-capped compound trimellitic anhydride was added, reacted for 5 hours, and stopped stirring to obtain a polyamic acid solution with an apparent viscosity of 7000 cps.

[0032] 2. Use a filter membrane with a pore size of 0.3 μm to filter the polyamic acid solution obtained in step 1 through positive pressure. After vacuum defoaming, it is uniformly coated on a clean substrate with a predetermine...

Embodiment 3

[0034] 1. In the reactor, add solvent N-methylpyrrolidone 265.74g, turn on mechanical stirring, then add diamine compound 4,4-diaminobiphenyl-3,3-tetracarboxylic acid 1.99g and p-phenylenediamine 12.38g, control the temperature at 30℃, stir for 30min, add dianhydride compound 3,3'4,4'-biphenyltetracarboxylic dianhydride 35.31g after complete dissolution, the viscosity of the reaction solution gradually increases, after 8 hours of reaction, the temperature rises At 50°C, after 5 hours of reaction, the temperature was lowered to 25°C, 0.94 g of end-capped compound trimellitic anhydride was added, the reaction was performed for 6 hours, and stirring was stopped to obtain a polyamic acid solution with an apparent viscosity of 6000cps.

[0035] 2. Use a filter membrane with a pore size of 0.3 μm to filter the polyamic acid solution obtained in step 1 through positive pressure. After vacuum defoaming, it is uniformly coated on a clean substrate with a predetermined thickness, and pre-d...

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Abstract

The invention belongs to the field of high polymer materials, and particularly relates to a preparation method of a polyimide film with a synergistic crosslinking structure and application of the polyimide film in a flexible display substrate. The polyimide film is prepared from an active carboxyl-containing diamine compound, an aromatic diamine compound, a dianhydride compound and an active group-containing terminated compound through polycondensation, imidization and high-temperature crosslinking. Synergistic crosslinking occurs between active carboxyl groups on the diamine compound containing active carboxyl groups, between reactive active groups in the terminated compound, and between the two active groups at high temperature to form a three-dimensional network structure, so that the CTE of the polyimide film is reduced, and the thermal dimensional stability is improved. Compared with the prior art, the blended polyimide film provided by the invention has the advantages of high temperature resistance, high dimensional stability and good mechanical strength, and can be applied to flexible display backboards.

Description

technical field [0001] The invention relates to the field of polymer films, in particular to a preparation method of an imide film with a synergistic cross-linking structure and its application in a flexible display substrate. Background technique [0002] Aromatic polyimide is a rigid material containing five-membered imide rings in the main chain of the molecule. It has excellent high temperature resistance, mechanical properties, chemical resistance, dimensional stability, insulating properties, and radiation resistance. And flame retardant properties, etc., so it is widely used in aerospace, construction machinery, weaponry and microelectronics semiconductor fields. Among them, in the field of electronic display, polyimide substrates with flexible and lightweight characteristics have gradually become one of the main development directions of display technology. [0003] However, compared with inorganic materials, polyimide has poor thermal stability, which is mainly ref...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C08L79/08G09F9/30
CPCC08G73/1067C08G73/1007C08G73/1014C08G73/1085C08J5/18G09F9/301C08J2379/08
Inventor 杨才冉卞卿卿邱孜学胡凯武国威
Owner SHANGHAI PLASTICS RES INST CO LTD
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