Hot melt adhesive as well as preparation method and application thereof

A hot melt adhesive and reaction kettle technology, applied in the field of resin, can solve the problems of large smoke and pungent odor, high power consumption of production equipment, and high production cost, and achieve the effects of improving processing environment, improving environmental protection and reducing melting point.

Pending Publication Date: 2022-07-05
北京欧森克林科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The hot melt adhesives currently on the market basically have the following disadvantages in the preparation process: 1. During the production process, large smoke and pungent odors will be generated, which will pollute the environment; 2. The existing process production When the hot melt adhesive is used, it needs to be melted at a higher temperature; 3. In the production process, it needs to be at a high temperature of 200 ° C for a long time, the production equipment consumes a lot of power, and the production cost is high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The hot melt adhesive of the present invention is composed of the following raw materials in parts by weight: 40 parts of ethylene-vinyl acetate copolymer, 20 parts of vinyl acetate, 7 parts of hydroxyapatite and 25 parts of resin.

[0042] Its preparation method is as follows:

[0043] (1) Pulverize hydroxyapatite, mix with resin,

[0044] (2) adding hydroxyapatite and resin into the reaction kettle, stirring uniformly under the condition of 170-℃;

[0045] (3) in reactor, add ethylene-vinyl acetate copolymer and vinyl acetate;

[0046] (4) the reaction temperature was controlled at 110°C, and the acid was discharged for 20min;

[0047] (5) Lowering the temperature to below 90° C. to obtain the hot melt adhesive.

Embodiment 2

[0049] The hot melt adhesive of the present invention is composed of the following raw materials in parts by weight: 50 parts of ethylene-vinyl acetate copolymer, 30 parts of vinyl acetate, 9 parts of hydroxyapatite and 35 parts of resin.

[0050] Its preparation method is as follows:

[0051] (1) Pulverize hydroxyapatite, mix with resin,

[0052] (2) adding hydroxyapatite and resin into the reaction kettle, stirring uniformly at 180°C;

[0053] (3) in reactor, add ethylene-vinyl acetate copolymer and vinyl acetate;

[0054] (4) the reaction temperature was controlled at 120°C, and the acid was discharged for 30min;

[0055] (5) Lowering the temperature to below 90° C. to obtain the hot melt adhesive.

Embodiment 3

[0057] The hot melt adhesive of the present invention is composed of the following raw materials in parts by weight: 60 parts of ethylene-vinyl acetate copolymer, 40 parts of vinyl acetate, 10 parts of hydroxyapatite and 4050 parts of resin.

[0058] Its preparation method is as follows:

[0059] (1) Pulverize hydroxyapatite, mix with resin,

[0060] (2) adding hydroxyapatite and resin into the reaction kettle, stirring uniformly at 200°C;

[0061] (3) in reactor, add ethylene-vinyl acetate copolymer and vinyl acetate;

[0062] (4) the temperature of reaction is controlled under 130 ℃ of conditions, acid discharge 50min;

[0063] (5) Lowering the temperature to below 90° C. to obtain the hot melt adhesive.

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PUM

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Abstract

The invention belongs to the technical field of resin, and particularly relates to a hot melt adhesive as well as a preparation method and application thereof. The hot melt adhesive is prepared from the following raw materials in parts by weight: 40 to 60 parts of ethylene-vinyl acetate copolymer, 20 to 40 parts of vinyl acetate, 6 to 10 parts of hydroxyapatite and 20 to 50 parts of resin. In the production process of the hot melt adhesive, smoke dust and smell cannot be generated, no toxicity, no formaldehyde and no pollution can be achieved, and the processing environment can be greatly improved when the hot melt adhesive is processed; the melting point of the hot melt adhesive disclosed by the invention is reduced, and the hot melt adhesive is better in flowability, so that the hot melt adhesive is stronger in seepage force and larger in adhesive force.

Description

technical field [0001] The invention belongs to the technical field of resins, and in particular relates to a hot melt adhesive and a preparation method and application thereof. Background technique [0002] Hot melt adhesive (English name: Hot Glue) is a plastic adhesive. Its physical state changes with the temperature change within a certain temperature range, but its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product. Because the product itself is solid, it is easy to package, transport, store, solvent-free, pollution-free and non-toxic. [0003] EVA hot melt adhesive is a kind of solid meltable polymer that does not need solvent and does not contain 100% moisture; it is solid at room temperature, and it is heated and melted to a certain temperature to become a liquid that can flow and has a certain viscosity. The melted EVA hot melt adhesive is light brown or white. EVA hot melt adhesive is composed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J11/04C09J123/08C09J131/04C09J157/02C09J193/04
CPCC09J4/06C09J11/04C09J123/0853C08L31/04C08L57/02C08L93/04C08K3/32
Inventor 张雪莹郑刚
Owner 北京欧森克林科技有限公司
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