Electromagnetic shielding packaging body and preparation method thereof

Abstract

The invention relates to the technical field of integrated circuit board packaging, and discloses an electromagnetic shielding packaging body and a preparation method thereof.The electromagnetic shielding packaging body comprises an integrated circuit board, the integrated circuit board comprises a substrate and an electronic assembly, a grounding end is arranged on the outer peripheral face of the upper side of the substrate, the electronic assembly is arranged on the upper side face of the substrate, and the grounding end is arranged on the outer peripheral face of the substrate; the grounding end is positioned on the periphery of the electronic component; the insulating film is attached to the outer peripheral surface of the upper side of the electronic assembly and covers the grounding end, the electronic assembly is located between the insulating film and the substrate, a groove penetrating through the two side faces of the insulating film is formed in the insulating film, a conductive part is arranged in the groove, and one end of the conductive part is connected with the grounding end; and the shielding film is attached to the upper side surface of the insulating film and covers the groove, and the shielding film is connected with the other end of the conductive part.

Description

technical field [0001] The invention relates to the technical field of integrated circuit board packaging, in particular to an electromagnetic shielding package and a preparation method thereof. Background technique [0002] In an integrated circuit, in order to ensure the normal operation of the electronic components on the circuit board, it is generally necessary to do electromagnetic shielding for the electronic components, one is to comply with the electromagnetic compatibility (EMC) specification, and the other is to avoid the electronic components from being subjected to external electromagnetic interference (EMI) or to avoid Electromagnetic waves generated by electronic components radiate outward. The traditional method is to install the metal shield on the circuit board, and connect it with the ground terminal to build a "Faraday cage", which has an effective electromagnetic shielding effect. However, due to the large size of the metal shield, it is difficult for the...

AI Technical Summary

Problems solved by technology

Due to the complex structure of the circuit board, the spraying technology needs to do complex masking treatment, and the sprayed paste is easy to accumulate between the narrow-pitch electronic components, which increases the weight of the circuit board. Therefore, the spraying conformal technology is difficult to adapt to high-density integrated circuits. plate

For the film-covered conformal technology, when the integration degree of the circuit board is high, the gap between the electronic components is very small, and the process requirements are high, and because the shielding film is difficult to achieve accurate positioning, not only the process requirements are high, but also It is easy to cause unreliable grounding of the shielding film and poor shielding effect

In addition, the shielding film is prone to contact with other conductive terminals on the electronic component to cause a short circuit

Images