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Lead frame coarsening process

A lead frame and roughening technology, applied in the field of lead frame roughening process, can solve the problems of high cost, low yield, poor stability of lead frame roughening process, etc., achieve high yield, eliminate material differences, and ensure consistency Effects of Sex and Stability

Pending Publication Date: 2022-07-15
崇辉半导体(江门)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve the problems of poor stability, low yield and high cost of the lead frame roughening process, the application provides a lead frame roughening process

Method used

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  • Lead frame coarsening process
  • Lead frame coarsening process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Pretreatment: Clean the S0P094-16L lead frame: The S0P094-16L lead frame is subjected to the electrolytic degreasing process and the water washing I process by means of bipolar degreasing, and then the S0P094-16L lead frame is cleaned with 10% sulfuric acid. Washing II process. Then, the SOP094-16L lead frame was used as the cathode and the oxygen-free copper column was used as the anode, and electroplating was carried out in the electroplating liquid, and the current density was controlled to 3ASD to obtain a lead frame with a copper plating thickness of 4 μm, and then a copper plating thickness of 4 μm. The lead frame to be roughened is obtained after cleaning with pure water.

[0048] Spray roughening: use the roughening syrup at a temperature of 35 ℃, at a rate of 0.7Kg / cm 2 The spray pressure of the lead frame to be roughened is continuously sprayed for 90s, and the roughening liquid is kept at a 45° angle with the surface of the lead frame to be roughened during ...

Embodiment 2

[0050] The difference between this example and Example 1 is that the current density during electroplating is controlled to be 2ASD, and the specific process conditions are shown in Table 1.

Embodiment 3

[0052] The difference between this example and Example 1 is that the current density during electroplating is controlled to be 5 ASD, and the specific process conditions are shown in Table 1.

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Abstract

The invention relates to the technical field of lead frame coarsening, and particularly discloses a lead frame coarsening process. The invention relates to a lead frame coarsening process, which comprises the following steps of: firstly cleaning a lead frame, then electroplating to obtain a lead frame with a plating layer, cleaning the lead frame with the plating layer to obtain a lead frame to be coarsened, and then spraying the lead frame to be coarsened by using a coarsening liquid medicine. According to the lead frame coarsening process provided by the invention, the surface coarsening of the lead frame is good, the coarsening process is relatively low in cost, the process is simple and stable, the yield of the coarsened lead frame is high, and the lead frame coarsening process is suitable for large-scale production and can meet the reliability requirement on a circuit chip in the industry.

Description

technical field [0001] The present application relates to the technical field of lead frame roughening, and more particularly, to a lead frame roughening process. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key component to form the electrical circuit by means of bonding materials such as gold wire, aluminum wire or copper wire to realize the electrical connection between the terminal of the internal circuit of the chip and the outer lead. A lead frame is required in the semiconductor integrated block, and the lead frame is an important basic material in the electronic information industry. In recent years, the semiconductor packaging industry has higher and higher requirements for the reliability of integrated circuit chips, and one of the ways to improve the reliability of the chip is to increase the surface roughness of the lead frame, thereby enhancing the bonding force between the lead frame and the packaging resin, t...

Claims

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Application Information

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IPC IPC(8): C25D7/00C25D3/40C25D5/34C25D5/48H01L21/48
CPCC25D7/00C25D3/40C25D5/34C25D5/48H01L21/4828H01L21/4821
Inventor 罗小平郑建国
Owner 崇辉半导体(江门)有限公司
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