High-thermal-conductivity wear-resistant UPR/polyamide composite film and preparation method thereof

Abstract

The invention discloses a high thermal conductivity wear resistant UPR / polyamide composite film and a preparation method thereof, the composite film comprises the following components by weight: 1%-8% of modified alumina (Al2O3), 10%-20% of unsaturated polyester (UPR), 0%-5% of a thermoplastic polymer, 20%-60% of polyamide, 2%-5% of a coupling agent, and other auxiliary agents. The preparation method specifically comprises the following steps: firstly, preparing and modifying Nano-ZrO2 / Al2O3, then preparing the URR composite material, and finally preparing the UPR / polyamide composite film. The method has the beneficial effects that the preparation process is simple, the yield is high, the maximum heat conductivity coefficient can reach 1.21 W / mK, the product validity period is long, the method can be applied to machine room outer wall film covering, and the prepared film is used for wall laying and is low in cost and good in heat conductivity and mechanical property.

Description

technical field [0001] The invention relates to a high thermal conductivity and wear-resistant UPR / polyamide composite film and a preparation method thereof, belonging to the technical field of plastic films. Background technique [0002] In recent years, with the advent of the 5G era, electronic information equipment with high heat generation has been widely used. The equipment in the information room generates a lot of heat, and considering the requirements of the heat dissipation performance of the computer room, air conditioners and ventilation systems are generally used to ensure the safe operation of the equipment in the computer room, resulting in a very high energy consumption of the air conditioners, which accounts for an average of the total power consumption of the equipment in the entire computer room. 50% or so. Therefore, seeking a cooling method with low energy consumption and high efficiency has become a hot research topic. [0003] At present, the commonly...

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Problems solved by technology

However, due to cost factors, the wall materials currently used for computer room construction are mainly brick walls, and waterproof and breathable membranes are laid for heat insulation; or metal walls are used, but the sound insulation effect is poor and they are not resistant to weather