Polymer composite material based on aromatic compound modified heat-conducting insulating composite powder and preparation of polymer composite material

An aromatic compound and composite powder technology, which is applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as troublesome processes, and achieve the effects of easy formation, simple and easy modification methods, and easy heat conduction network paths.

Pending Publication Date: 2022-07-29
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And the h-BN needs to be hydroxylated before the surface polyglycerol methacrylate is modified, the process is very troublesome

Method used

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  • Polymer composite material based on aromatic compound modified heat-conducting insulating composite powder and preparation of polymer composite material
  • Polymer composite material based on aromatic compound modified heat-conducting insulating composite powder and preparation of polymer composite material
  • Polymer composite material based on aromatic compound modified heat-conducting insulating composite powder and preparation of polymer composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] (1) 10 g of thermally conductive inorganic particles h-BN powder and Al 2 O 3 The powder was dispersed in 400 ml of deionized water, and ultrasonically dispersed for 2 hours to obtain dispersions A and B;

[0057] (2) 1g of dopamine hydrochloride was dispersed in 100ml of deionized water respectively, and ultrasonically dispersed for 30min to obtain dispersions C and D;

[0058] (3) A dispersion liquid and C dispersion liquid are mixed respectively, B dispersion liquid and D dispersion liquid are mixed, while stirring, drip Tris-HCl buffer solution and ammoniacal liquor, adjust pH to be 8.5, obtain E and F dispersion liquid;

[0059] (4) stirring E and F dispersions respectively at 600r / min at room temperature for 24 hours;

[0060] (5) Stand E and F dispersions, centrifuge at 5000r / min for 10min respectively, take the precipitate and wash it with clean water for 3-5 times, and then put it in an 80°C oven to dry for 12h (of course, other drying temperatures and drying...

Embodiment 2

[0066] (1) 10 g of thermally conductive inorganic particles h-BN powder and Al 2 O 3 The powder was dispersed in 400 ml of deionized water, and ultrasonically dispersed for 2 hours to obtain dispersions A and B;

[0067] (2) 1g of dopamine hydrochloride was dispersed in 100ml of deionized water respectively, and ultrasonically dispersed for 30min to obtain dispersions C and D;

[0068] (3) A dispersion liquid and C dispersion liquid are mixed respectively, B dispersion liquid and D dispersion liquid are mixed, while stirring, drip Tris-HCl buffer solution and ammoniacal liquor, adjust pH to be 8.5, obtain E and F dispersion liquid;

[0069] (4) stirring E and F dispersions respectively at 600r / min at room temperature for 24 hours;

[0070] (5) Stand E and F dispersions, centrifuge at 5000r / min for 10min respectively, take the precipitate and wash it with clean water for 3-5 times, and then put it in an 80°C oven to dry for 12h (of course, other drying temperatures and drying...

Embodiment 3

[0076] (1) 10 g of thermally conductive inorganic particles h-BN powder and Al 2 O 3 The powder was dispersed in 400 ml of deionized water, and ultrasonically dispersed for 2 hours to obtain dispersions A and B;

[0077] (2) 1g of dopamine hydrochloride was dispersed in 100ml of deionized water respectively, and ultrasonically dispersed for 30min to obtain dispersions C and D;

[0078] (3) A dispersion liquid and C dispersion liquid are mixed respectively, B dispersion liquid and D dispersion liquid are mixed, while stirring, drip Tris-HCl buffer solution and ammoniacal liquor, adjust pH to be 8.5, obtain E and F dispersion liquid;

[0079] (4) stirring E and F dispersions respectively at 600r / min at room temperature for 24 hours;

[0080](5) Stand E and F dispersions, centrifuge at 5000r / min for 10min respectively, take the precipitate and wash it with clean water for 3-5 times, and then put it in an 80°C oven to dry for 12h (of course, other drying temperatures and drying ...

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Abstract

The invention belongs to the field of micro-nano particle modification and electronic packaging heat conduction materials, and discloses a polymer composite material based on aromatic compound modified heat conduction insulation composite powder and preparation of the polymer composite material, and the polymer composite material is obtained by adding the aromatic compound modified insulation composite powder into a polymer matrix material; the insulating composite powder modified by the aromatic compound is prepared by taking at least two kinds of heat-conducting micro-nano insulating powder as raw materials, taking the aromatic compound as a modifying agent, adopting an aqueous solution stirring method and utilizing pi-pi interaction and covalent interaction between the modifying agent and the micro-nano insulating powder under the action of shearing force. And adsorbing the modifier to the surface of the powder. On the basis of ensuring the thermal conductivity, the viscosity of the polymer composite material can be greatly reduced, and the problem that low viscosity and high thermal conductivity cannot be achieved at the same time when the polymer is filled with the inorganic insulating powder can be solved.

Description

technical field [0001] The invention belongs to the field of micro-nano particle modification and electronic packaging heat-conducting materials, and more particularly, relates to a polymer composite material based on an aromatic compound-modified heat-conducting and insulating composite powder and its preparation. Insulating composite powder, and then using the modified thermally conductive and insulating composite powder as a filler to compound the polymer matrix, thereby obtaining a polymer composite material with both high thermal conductivity and low viscosity properties. Background technique [0002] The improvement of nano-manufacturing technology and process level has made integrated circuits develop towards high integration, miniaturization and light weight, especially the wide application of 5G technology, which has led to the continuous increase in the heat flux density of integrated circuits in electronic devices. The increase in temperature of electronic devices...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/10C08K3/38C08K3/22C09K5/14
CPCC08K9/10C08K3/38C08K3/22C09K5/14C08K2003/385C08K2003/2227C08L2203/206C08L63/00
Inventor 杨君友罗裕波李优钱勇鑫严伟徐超超郝吉年陶阳
Owner HUAZHONG UNIV OF SCI & TECH
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