Photosensitive resin composition and dry film resist laminate thereof
A photosensitive resin, photosensitive resin technology, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problems of developing speed, film removal speed, insufficient film removal debris, etc., and achieve excellent resolution and adhesion, low biotoxicity, increased toughness and adhesion
Pending Publication Date: 2022-08-05
杭州福斯特电子材料有限公司
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0008] Through the analysis of existing patents, generally good resolution and adhesion can be obtained, but there are still deficiencies in the development speed, film withdrawal speed, and film fragmentation
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0046] In order to further illustrate the technical effect of the present invention, the embodiments of the present invention are described in detail below.
[0047] The specific embodiment is only an explanation of the present invention, not a limitation of the present invention. Any changes made by those skilled in the art after reading this specification, as long as they are within the scope of the claims, will be protected by the patent law. .
[0048] 1. Alkali-soluble resin A: prepared by solution polymerization, the solvent is acetone
[0049]
[0050]
[0051] 2. Photopolymerizable monomer B
[0052] B1: (8) ethoxylated nonylphenol acrylate;
[0053] B2: (10) ethoxylated bisphenol A diacrylate;
[0054] B3: (3) ethoxylated trimethylolpropane triacrylate;
[0055] B4: polyethylene glycol (400) dimethacrylate;
[0056] 3. Photoinitiator C
[0057] C1: 2,2',4-Tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4',5'-diphenyl-1,1'-diimidazole ;
[0058] C2: N-phenyl...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a photosensitive resin composition and a dry film anti-corrosion laminated body thereof, and belongs to the technical field of printed circuit boards. The photosensitive resin composition comprises alkali-soluble resin, a photopolymerizable monomer and a photoinitiator, the alkali-soluble resin at least comprises a chain segment formed by a vinyl carbonate I monomer, and the vinyl carbonate I is vinyl carbonate with a benzene ring. The vinyl carbonate I containing a benzene ring structure is adopted to prepare the photosensitive resin composition, so that the photosensitive resin composition has excellent resolution and adhesive force, and a chain segment formed by the vinyl carbonate I monomer can be decomposed to form a structure with hydroxyl and CO2, so that the vinyl carbonate I monomer can interact with a film stripping liquid in a film stripping process, and the film stripping liquid can be separated from the film stripping liquid. And meanwhile, the released gas can accelerate the stripping process, so that the film stripping speed is relatively high, and the production efficiency is improved.
Description
technical field [0001] The invention relates to a photosensitive resin composition and a dry film resist laminate thereof, belonging to the technical field of printed circuit boards. Background technique [0002] In the context of the large-scale popularization of intelligent terminal equipment and the rapid advancement of 5G construction, new changes are taking place in the technology of the printed circuit board (PCB) industry. As far as PCB products are concerned, high density, flexibility, and high integration are the future. Direction of development. In the manufacture of printed circuit boards, a photosensitive resin composition used as a resist material for pattern transfer in etching or electroplating and a dry film resist layer containing the photosensitive resin composition between a support film and a protective film are widely used . Generally, a dry film resist layer is laminated on a copper substrate. After exposure, the unexposed part of the dry film resist ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): G03F7/004G03F7/027G03F7/09C08F218/00C08F212/08C08F220/14C08F220/06C08F218/08C08F220/34
CPCG03F7/004G03F7/027G03F7/09C08F218/24C08F212/08C08F220/14C08F220/06C08F218/08C08F220/343
Inventor 詹志英吴强朱高华李伟杰宋赣军
Owner 杭州福斯特电子材料有限公司