A kind of photosensitive resin composition and its application
A technology of photosensitive resin and resin composition, which is applied in the field of photosensitive resin composition, can solve the problems of no FPC research, etc., and achieve the goal of improving film removal efficiency, excellent adhesion and flexibility, and improving production efficiency and product yield Effect
Active Publication Date: 2021-11-02
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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Problems solved by technology
Patent document CN1828111B provides a kind of anti-plating photosensitive resin composition for implementing two or more different electroless plating layers. By regulating the total number of moles of ethylenically unsaturated groups in the resin composition, its plating resistance and Excellent stripping performance, however, unfortunately, no further research has been done on the issue of FPC film release
Patent document CN102144189B provides a kind of photosensitive resin composition, by adding polyoxyethylene (tris(1-phenylethyl)) phenyl ether modified by ethylene oxide, its resolution, adhesion, capping performance Excellent, and excellent peeling performance, but no further research on the issue of FPC film release
Method used
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Embodiment 1-6
[0039] (Example 1-6, Comparative Example 1-6)
[0040] The components were mixed according to the formulations 1 and 2 below, and 60 parts by weight of the acetone was added, and then thoroughly stirred to completely dissolve, and the solid content was 40% resin composition solution. It is applied to the surface of the PET film (thickness 15 um) as a support film by a coater, placed in an oven at 85 ° C, a dry film resist layer having a thickness of 20 um, and green is presented under a yellow light. Next, a polyethylene film having a protective layer is bonded therefrom, and the thickness is 20 um, so that the photosensitive dry film of the three-layer structure is obtained.
[0041] It should be noted that the binder polymer A in Table 1 and Table 2 is prepared by itself, using a solution polymerization method, the main component is methacrylic acid / acrylic / methacrylate / methacrylate / acrylate / acrylate / Styrene = 18 / 5 / 45 / 15 / 9 / 8 (MW = 72,000).
[0042] Photoelectric mo...
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Abstract
The invention discloses a photosensitive resin composition and its application. The resin composition comprises 30-70 parts by weight of an adhesive polymer, 10-50 parts by weight of a photopolymerizable monomer, and 0.5-10.0 parts by weight of a photoinitiated agent and 0.1-10.0 parts by weight additive, the molar weight of ethylenically unsaturated double bonds in the photopolymerizable monomer is 0.5-2.0m mol / g resin composition, and the additive contains ethylene oxide-propylene oxide block copolymer; The invention regulates the amount of ethylene oxide-propylene oxide block copolymer and the molar weight of ethylenically unsaturated double bonds in the photopolymerizable monomer, so that when the prepared resin composition is used as a dry film resist, it has The film is easy to break, the size of the film fragments is moderate, and the film removal speed is fast. At the same time, the line resolution, adhesion and flexibility are excellent, so the film removal efficiency can be improved, and the production efficiency and product yield can be improved.
Description
Technical field [0001] The present invention is in the field of printed circuit boards, relates to a photosensitive resin composition and uses thereof. [0002] technical background [0003] A printed wiring board is a printed circuit board with an insulating, rigid division in accordance with the hardness of the flexible and rigid-flex three. Wherein the flexible circuit boards, also known as flexible circuit boards, flexible circuit boards, referred to as an FPC board or flexible, having a high wiring density, light weight, thin, small wiring space limitations, high flexibility, etc., in full compliance with the electronic smaller and faster product development trends, is an effective solution to meet the miniaturization of electronic products and mobile requirements. FPC can be freely curved, winding, folding, and can withstand millions of times without damaging the dynamic bending wire can be arranged in accordance with the requirements of any space layout, and any telescopic ...
Claims
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IPC IPC(8): G03F7/004G03F7/033
CPCG03F7/004G03F7/033
Inventor 韩传龙李伟杰李志强朱薛妍周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD