All SiNx microstructure resonance beam pressure sensor
A pressure sensor and resonant beam technology, which is applied in the measurement of fluid pressure, the use of mechanical devices to transmit sensing components, and the measurement of fluid pressure through mechanical components, etc., can solve the problem that the thickness of the silicon pressure sensitive film cannot be accurately controlled, the sensor range and the design value difference. Large, impossible high-density integration and other problems, to achieve the effect of reducing device cost, good uniformity, and good machinability
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[0019] From Figure 5 , Figure 6 and figure 1 , figure 2 Comparing the resonant beam pressure sensor chips, we can clearly see the full SiN x Microstructure resonant beam pressure sensors are different from silicon microstructure resonant beam pressure sensors. The chip of the silicon microstructure resonant beam pressure sensor is composed of two silicon chips that have been three-dimensionally processed and bonded together, all SiN x The microstructure resonant beam pressure sensor chip is just a three-dimensional processed silicon chip. The manufacturing process is simplified.
[0020] From Figure 5 and image 3 Comparing we can see that SiN x Microstructure resonant beam pressure sensor chip and new composite beam membrane SiN x The obvious difference between the microstructure resonant beam pressure sensor is SiN x The pressure sensitive membrane 17 of the microstructure resonant beam pressure sensor chip is made of ultra-thick and low-stress SiN x material....
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