Anisotropic conductive connecting material

A conductive connection material, anisotropic technology, applied in the connection of conductive materials, conductive materials, conductive adhesives, etc., can solve the problem of reduced connection reliability

Inactive Publication Date: 2005-04-13
DEXERIALS CORP
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] A countermeasure to this problem is to use conductive particles that form a metal coating on a resin core that deforms under a relatively low load. In the case of a change in the size of the connection part, it cannot follow this change, and in particular, there is a problem that the connection reliability is greatly red...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4 and comparative example 1～2

[0033] The composition shown in Table 1 is uniformly mixed according to the usual method, and the resulting mixture is coated on a 50 μm thick polyethylene terephthalate film that has been peeled off, and dried until the residual solvent is below 1%, to obtain 1.5μm thick anisotropic conductive connection film (ACF). In addition, Table 2 has listed the elastic modulus (KN / mm) of the conductive particles used in each implementation and each comparative example at 25°C and pressure-bonding temperature (130°C). 2 ) and recovery rate (%), and the ratio (%) of the elastic modulus at 130°C to the elastic modulus at 25°C.

[0034] Element

weight%

Epoxy acrylate (3002A, Kyoeisha Chemical (Company)

50

Phenoxy resin (YP50, Dongdu Chemical Co., Ltd.)

44

Organic peroxide (Perhexa 3M, NOF Corporation)

3

Conductive particles

3

[0035] The obtained ACF was sandwiched between a plastic substrate (polyethersulf...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The anisotropic conductive connection material does not cause cracks on the electrodes even when a plastic substrate with ITO electrodes is used when the opposite substrates are anisotropically connected, and the connection reliability does not decrease after aging. The anisotropic conductive connection material composed of conductive particles dispersed in the insulating adhesive is arranged between the connection terminals of the first and second substrates, and the thermal compression bonding process ensures the conduction between the two and makes them connect. As electroconductive particle, the base elastic modulus in the pressure bonding temperature is 200% or less of the elastic modulus of the 1st board|substrate in the pressure bonding temperature. Moreover, it is more preferable to use what the elastic modulus at a pressure bonding temperature is 60 to 90% of the elastic modulus at 25 degreeC as electroconductive particle.

Description

technical field [0001] The present invention relates to an anisotropic conductive connection material suitable for the manufacture of a liquid crystal panel using a plastic substrate. Background technique [0002] A liquid crystal panel having a liquid crystal element in which liquid crystal is sealed between a pair of transparent glass substrates is used in commonly used electronic devices such as mobile phones and mobile terminals. [0003] Such a liquid crystal panel is an anisotropic conductive connection in which conductive particles are dispersed in a thermosetting insulating adhesive between the ITO electrodes on the glass substrate of the liquid crystal element and the connection terminals of the flexible substrate. The material is bonded by heat and pressure to ensure conduction, and at the same time, the two are connected to make it. [0004] Recently, in order to reduce the weight and thickness of liquid crystal panels, attempts have been made to replace transpar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G02F1/1345B32B37/14H01B1/00H01B1/22H01B5/16H01R4/04H05K3/32H05K3/36
CPCB32B37/144B32B2305/55B32B2307/202B32B2307/54B32B2307/706B32B2379/08H01R4/04H05K3/323H05K3/361H05K2201/0129H05K2201/0221H05K2201/0233G02F1/1345
Inventor 齐藤雅男
Owner DEXERIALS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap