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Method for manufacturing jet hole piece of ink jet type print head by using microfilm procedure

A manufacturing method and printing head technology, applied in printing and other directions, can solve problems such as expensive, difficult to accurately control process conditions, and costly

Inactive Publication Date: 2003-10-01
NANODYNAMICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this electroforming method will have the following disadvantages: first, it is not easy to accurately control the process conditions, such as stress and plating thickness; second, the design options such as the shape and size of the nozzle hole are limited; third, the process cost is too high , cannot meet the needs of mass production; fourth, the problem of ink corrosion orifice sheet is prone to occur. Although gold (Au) can be electroplated on the surface of the orifice sheet to delay the corrosion phenomenon, it will cost more
In order to solve the above problems, the current technology adopts excimer laser (excimer laser) processing method to make orifice sheets, but this will encounter problems such as misalignment, too large and expensive equipment, etc.

Method used

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  • Method for manufacturing jet hole piece of ink jet type print head by using microfilm procedure
  • Method for manufacturing jet hole piece of ink jet type print head by using microfilm procedure
  • Method for manufacturing jet hole piece of ink jet type print head by using microfilm procedure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0012] Figure 1A to Figure 1G It is a schematic cross-sectional view of an orifice sheet for making an inkjet print head according to the first embodiment of the present invention. first, Figure 1A As shown, a semiconductor silicon substrate 10 is provided, and its surface includes at least one actuating component 12 (for example: a thin film heater), and then a first thin film 14 is covered on the surface of the silicon substrate 10 by pressing film or other deposition methods. , its material can be selected from photosensitive polymer materials, such as: epoxy resin (epoxy), phenolic resin (novolak), acrylic resin (arcylate), polyimide (polyimide), polyamide (polyamide) or Photosensitive polymer material. Next, if Figure 1B As shown, the first film 14 in the first predetermined area I is exposed and developed to form a first opening 16 in the first film 14, and its position is corresponding to the top of the actuator assembly 12. For use as an ink channel (ink channel)...

no. 2 example

[0017] Figure 2A to Figure 2G It is a schematic cross-sectional view of an orifice sheet for making an inkjet print head according to the second embodiment of the present invention. First, if Figure 2A As shown, a semiconductor silicon substrate 30 is provided, and its surface includes at least one actuating component 32 (for example: a thin film heater), and then a first thin film 34 is covered on the surface of the silicon substrate 30 by pressing film or other deposition methods. , the material can be selected from photosensitive polymer materials, such as epoxy resin, phenol resin, acrylic resin, polyimide, polyamide or photosensitive polymer materials. Next, the exposure and development processes are carried out on the first thin film 34 in the first predetermined area I, so as to form a first opening 36 in the first thin film 34, and its position is corresponding to the top of the actuating component 32, which can be used Used as an ink channel.

[0018] follow, suc...

no. 3 example

[0022] In order to further simplify the manufacturing process of the orifice sheet in the second embodiment, the third embodiment of the present invention proposes another exposure and development step, which can be applied when the materials of the first film and the second film are different.

[0023] Figure 3A to Figure 3H It is a schematic cross-sectional view of an orifice sheet for making an inkjet print head according to the third embodiment of the present invention. First, if Figure 3A As shown, a semiconductor silicon substrate 40 is provided, and its surface includes at least one actuating component 42 (for example: a thin film heater), and then a first thin film 44 is covered on the surface of the silicon substrate 40 by pressing film or other deposition methods. , and its material can be selected from a polymer material with positive photoresist properties. Next, if Figure 3B As shown, the first exposure process is performed on the first thin film 44 in the f...

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Abstract

A process for preparing the jet pinhole chip of ink-jet print head by microfilm techonlogy features that the film is pressed on silicon substrate, exposed and developed to effectively control the position, diameter and shape of pinhole for higher print resolution. It may include exposure twice and developing once, or exposure twice and developing twice, or exposure on the first film, depositing the second film, developing the back of the first film, and exposure and developing the second film.

Description

technical field [0001] The invention relates to a manufacturing method of a nozzle plate of an inkjet printhead, in particular to a method for manufacturing a nozzle orifice with multiple exposure and development processes. Background technique [0002] The thermal inkjet printhead (thermal inkjet printhead) has been successfully commercialized in the mainstream products of computer printing equipment. Ink is ejected through nozzle orifices to print on paper. Generally speaking, a print head is composed of an ink cartridge, an orifice sheet with a plurality of orifices and a plurality of thin film heaters, wherein a thin film heater is arranged under each orifice, and a The ink channel wall is used for ink ejection from the corresponding position of the nozzle hole. [0003] The quality of inkjet printing technology mainly depends on the physical characteristics of the orifice of the column orifice sheet, such as: the undercut contour and opening shape of the orifice, whic...

Claims

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Application Information

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IPC IPC(8): B41J2/16
Inventor 林刘恭黄怡仁
Owner NANODYNAMICS INC
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