Metal-organic compound layer contained mask for near-field super resolution photomemory
An organic compound and super-resolution technology, which is applied in the field of optical storage, can solve the problem of reducing the light spot and achieve the effect of reducing the light spot, small thermal damage, and strong near-field optical signal
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Embodiment 1
[0018] On a clean and transparent glass substrate 6 with a thickness of 0.6mm, vacuum evaporation method (vacuum degree 2.7×10 -3 Pa), plated successively on the substrate: protective layer 1, metal-organic compound layer 2 and protective layer 3 as a mask, wherein protective layer 1 and protective layer 3 are zinc sulfide with a thickness of 20nm, and metal-organic compound layer 2 is Silver tetracyanoquinone dimethane with a thickness of 10 nm.
[0019] When the power density exceeds 1.3×10 3 W / cm 2 When a focused laser with a wavelength of 514.5nm acts on the metal organic compound layer 2 in the mask 4, the transmittance of the central region of the action increases by more than 30% at a wavelength of 514.5nm, and irregularly distributed sizes of 50- 150nm nano-silver particles can play a role of super-resolution near-field enhancement.
Embodiment 2
[0021] On a clean and transparent glass substrate 6 with a thickness of 0.6mm, vacuum evaporation method (vacuum degree 2.7×10 -3 Pa), plated successively on the substrate: protective layer 1, metal-organic compound layer 2 and protective layer 3 as a mask, wherein protective layer 1 and protective layer 3 are zinc sulfide with a thickness of 20nm, and the metal-organic compound layer 2 has a thickness of 40nm silver tetracyanoquinone dimethane.
[0022] When the power density exceeds 1.3×10 3 W / cm 2 When a focused laser with a wavelength of 514.5nm acts on the metal-organic compound layer 2 in the mask 4, the transmittance of the central region of the action increases by more than 50% at a wavelength of 514.5nm, and irregularly distributed sizes of 50- 150nm nano-silver particles can play a role of super-resolution near-field enhancement.
Embodiment 3
[0024] On a clean and transparent glass substrate 6 with a thickness of 0.6mm, the vacuum evaporation method is used to sequentially plate on the substrate: protective layer 1, metal organic compound layer 2 and protective layer 3 as a mask, wherein protective layer 1 and protective layer 3 are zinc sulfide with a thickness of 20nm, and the metal-organic compound layer 2 is copper tetracyanoquinodimethane with a thickness of 10nm. The structural mask 4 can play the role of super-resolution near-field enhancement.
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