Electronic sealer with three-dimensional stack and assembling method thereof
An electronic package, three-dimensional stacking technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of unstable yield, increase packaging cost, and complex manufacturing process.
Inactive Publication Date: 2004-12-08
IND TECH RES INST
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Problems solved by technology
However, this manufacturing method includes many related manufacturing processes such as mask making, photolithography, sputtering, electroplating, etc., as well as the manufacturing process of back-end assembly and solder ball array ball planting. The manufacturing process is quite complicated and the factors that affect the manufacturing process Too much will cause the manufacturing process to be unstable, and the packaging cost will be relatively increased
In addition, the through holes made on the chip can also be used as the vertical conduction path of the chip, but in the manufacturing process, the through holes of the chip need to be aligned and filled with conductive materials. It is quite difficult to make the pass rate unstable and cause difficulties in mass production
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[0015] In order to have a further understanding of the purpose of the present invention, structural features and functions thereof, the accompanying drawings are described in detail as follows:
[0016] Please refer to Figure 1A to Figure 1E , which is a schematic diagram of the production process of the first embodiment of the present invention. Such as Figure 1A As shown, a plurality of columnar conductive bumps 11 are fabricated on the bearing surface of the substrate 10 by using columnar solder ball (stud bump) method; then, as shown in FIG. Figure 1B As shown, a chip 20 with several through holes 21 corresponding to the columnar conductive bumps 11 is provided; then, the chip 20 and the substrate 10 are assembled, as Figure 1C As shown, the columnar conductive bump 11 is aligned through the through hole 21 of each chip 20, and the tail end of the columnar conductive bump 11 exceeds the height of the chip 20; thus, the chip 20 and the substrate 10 are bonded to form t...
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Combining with method of columnar solder ball and through hole in module, the assembling method joints modules in upper layer and lower layer and completes electrical connection. Columnar conducting lug formed on supporting body through method of columnar solder ball. Making columnar conducting lugs pass through holes in module to assemble modules on supporting body so as to complete 3D piled encapsulation for electronic parts. The invention lowers encapsulation cost and simplifies procedure of encapsulation, is applicable to IC and microelectronics manufacturing area.
Description
technical field [0001] The invention relates to an electronic package and its assembly method, in particular to a three-dimensional stacked electronic package and its assembly method. Background technique [0002] Electronic Packaging (Electronic Packaging) is also known as electronic packaging, and its purpose is to give integrated circuit components (IC) an organizational structure so that it can perform its intended functions. From the perspective of the manufacturing process of microelectronic products, electronic packaging belongs to the manufacturing technology of the back-end of the product, so packaging is often considered to be only one of the supporting roles of integrated circuit manufacturing technology. In fact, electronic packaging technology dominates the size and cost of electronic products, so the development of packaging technology is no less important than IC manufacturing technology and other microelectronics-related manufacturing technologies. [0003] ...
Claims
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Login to View More IPC IPC(8): H01L21/50H01L21/60H01L21/98H01L23/12H01L23/48H01L25/04
CPCH01L2224/16145
Inventor 陈守龙吕芳俊彭逸轩游善溥
Owner IND TECH RES INST