Dry powder putty for external wall

Abstract

The outer wall putty powder consists of dispersed polymer powder resin or powdered PVA 1-2 wt%, hydroxypropyl cellulose ether 0.8-1 wt%, white cement 25-30 wt%, coarse whiting 50-65 wt%, bentonite 3-5 wt%, deposited barium sulfate 3-5 wt% and plant fiber 0.3-0.5 wt%. The outer wall putty powder of the present invention has low cost, is compounded with water, rather than glue, and has high adhesion strength, environment friendship, and very powerful chapping and temperature change resistance.

Description

technical field [0001] The invention belongs to the technical field of building wall surface adhesion layer materials. Background technique [0002] At present, before brushing paint on the exterior wall surface of a building, a layer of putty material must be scraped. This adhesion layer is also called a batch of dust, which is prepared by mixing bonding materials and fillers. It can level the wall, fill holes and improve the smoothness of the paint surface at the same time. However, due to the thermal expansion and contraction caused by cement hardening, volume shrinkage, and temperature difference, cracks of various sizes will occur on the surface of the plaster wall once it is air-dried. Surface cracking and cracking. This kind of cracked wall surface often appears, which not only affects the appearance of the wall surface, but also causes wall leakage, which is a major problem in the construction industry. The traditional putty is composed of talc powder mixed with 1...

AI Technical Summary

Problems solved by technology

This kind of cracked wall surface often appears, which not only affects the appearance of the wall surface, but also causes wall leakage, which is a major problem in the construction industry

The traditional putty is composed of talcum powder mixed with 107 glue. This kind of putty has poor bonding strength, acid and alkali resistance, and weather resistance, and is prone to hollowing, shedding and cracking.

Some new types of putty have been introduced on the market now, but the defect is that except that there is no great improvement in cracking, acid and alkali resistance, and weather resistance, the thick paste-like putty that has been prepared is still used, which also causes problems in packaging, inconvenient transportation

From an environmental point of view, it does not meet the requirements

Moreover, due to the limitation of modulation products, it is not conducive to the promotion and application of putty technology.