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Laser working method

A laser processing method and laser technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as toxic waste liquid, affecting the surface finish of workpieces, and expensive chemical vapor deposition equipment

Inactive Publication Date: 2005-02-16
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the high-energy-density laser beam is driven into the workpiece 10', the periphery of the hole 12' on the surface of the workpiece 10' forms a nodular structure 101' due to the accumulation of molten material, and the molten material may splash out from the hole 12' and cause damage to the workpiece 10'. Particles 103' are formed on the surface of the workpiece, which affects the smoothness of the surface of the workpiece 12
[0007] In view of the above-mentioned shortcomings that the molten material affects the surface finish of the workpiece, Taiwan Patent Publication No. 400555 discloses a design that uses silicon oxide or silicon nitride as the surface protection layer of the workpiece
However, the formation of the protective layer of the above materials is generally achieved through a chemical vapor deposition (CVD) process, and some gases including toxic, corrosive, explosive, spontaneous combustion, and combustion-supporting gases will be generated during the chemical vapor deposition process. It is dangerous and polluting, and chemical vapor deposition equipment is expensive; when removing the protective layer of silicon oxide or silicon nitride, a wet etching process is required. The wet etching process uses a chemical solution to achieve chemical reaction. Etching purpose, however, the chemical solution for etching silicon oxide or silicon nitride contains a highly corrosive acidic solution, which will produce some toxic and corrosive waste liquid, and requires special etching equipment

Method used

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Embodiment Construction

[0014] see figure 2 , first coating a protective layer on the surface of the workpiece 10, the protective layer is a polyimide layer 102, and the polyimide layer 102 can be coated by immersion plating (dip-coating) or spin coating (spin-coating) etc., the polyimide layer 102 has a thickness of 500 angstroms to 500 microns.

[0015] see image 3 , when using a laser processing machine 20 to perform drilling processing on the workpiece 10, the laser beam first melts and vaporizes the polyimide layer 102, and then melts the workpiece 10 under the polyimide layer 102 to form holes 12, The molten material of the workpiece 10 scatters to the surface of the polyimide layer 102 to form particles 103 .

[0016] see Figure 4 After the hole 12 is processed, the polyimide layer 102 on the surface of the workpiece 10 is dissolved and removed by an acetone solvent or a phenolic solvent such as cresol, and the particles 103 on the polyimide layer 102 and (or) external dust, etc. are re...

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Abstract

The invention refers to a kind of laser processing method. At first a protecting coat which is polyimide layer is laid on the surface of the workpiece. And then the work such as stiletto is carried out at the workpiece, after which scour off the polyimide layer with acetone or phenols solutions. Because of the protection of the polyimide layer, the particles and dusts produced in the laser processing will sediment at the surface of the protection layer but the workpiece. We can get perfect workpiece surface after wipe off the protection layer.

Description

【Technical field】 [0001] The invention relates to a laser processing method, in particular to a laser processing method without surface defects. 【Background technique】 [0002] Lasers were the new light source of the 1960s. Due to the characteristics of good directionality, high brightness and good monochromaticity, laser has been widely used. Laser processing is one of the most promising fields of laser application, and more than 20 kinds of laser processing technologies have been developed. The space control and time control of the laser are very good, and the degree of freedom for the material, shape, size and processing environment of the processing object is very large, and it is especially suitable for automatic processing. The combination of laser processing system and computer numerical control technology can constitute efficient automatic processing equipment, which has become the key technology for enterprises to implement timely production. [0003] Laser proce...

Claims

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Application Information

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IPC IPC(8): B23K26/36C07C39/07C07C49/08C08G73/10
Inventor 陈杰良
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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