Method for mfg. printed circuitboard
A technology for printed circuit boards and manufacturing methods, applied in printed circuit manufacturing, printed circuits, removal of conductive materials by chemical/electrolytic methods, etc., capable of solving excessive etching undercuts, increased number of processes, and reduced circuit width, etc. question
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0054] 10 L of an etching solution consisting of 1% by weight of hydrogen peroxide, 4% by weight of sulfuric acid, 0.01% by weight of 1H-tetrazole, copper at a concentration of 20 g / L (liter), and water was prepared as the remainder.
[0055] [Measurement of etching rate]
[0056] A base plate (150×150 mm) on which 2 μm thick electroless copper plating was formed and a base plate (150×150 mm) on which 20 μm thick electrolytic copper plating was formed were produced. Using a spray etching machine, at a spray pressure of 0.1 MPa and a treatment temperature of 30° C., the electroless copper-plated base plate was etched for 15 seconds, and the electrolytic copper-plated base plate was etched for 30 seconds. The amount of etching was calculated from the weight difference of the substrate before and after the treatment. The dissolution rate ratio (etching rate ratio) is represented by the ratio of the etching amount per unit time obtained by dividing the etching amount of each proc...
Embodiment 2
[0060] In addition to using an etching solution consisting of 1.5% by weight of hydrogen peroxide, 5% by weight of sulfuric acid, 0.01% by weight of 1,2,4-triazole, copper with a concentration of 20g / L, and the remainder consisting of water, the same as the implementation The same experiment was carried out in Example 1.
Embodiment 3
[0062] Except using hydrogen peroxide by 1% by weight, sulfuric acid of 3% by weight, triethylenetetramine of 2% by weight, the copper of concentration 20g / L, the remainder is made up of water, same as Example 1 conduct experiment.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com