Terminal having surface layer , and part and product having the same

A surface layer and terminal technology, applied in the direction of contact parts, thin material processing, contact materials, etc., can solve the problems that the crystallization state and melting point are not specified, the generation of metal whiskers cannot be fully prevented, and solderability cannot be obtained. Achieve thin and uniform thickness

Active Publication Date: 2005-07-13
FCM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the crystallization state and melting point of the layer constituted by electroplating of the tin-silver-copper ternary alloy are not specified in this publication either, and therefore, the generation of whiskers cannot be sufficiently prevented by the method disclosed in the publication. and good solderability cannot be obtained

Method used

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  • Terminal having surface layer , and part and product having the same
  • Terminal having surface layer , and part and product having the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] First, as a conductive substrate, phosphor bronze rolled into a strip-shaped strip with a thickness of 0.3 mm and a width of 30 mm is stamped into the shape of a connector, and the processed intermediate formed in the shape of a continuous connector terminal is cut and grown. After the temperature is 100m, it is taken up with a reel. Then, this reel was set on the delivery shaft of the continuous plating apparatus.

[0100] Next, by continuous immersion in the immersion solution of the above-mentioned continuous plating device filled with an aqueous solution containing sodium hydroxide at a liquid temperature of 48° C. The above-mentioned conductive substrate is subjected to the first washing treatment for one minute. Thereafter, washing with water was performed several times.

[0101] Then, in the electrolytic tank (using 100 g / l of NC Rustol (manufactured by Okuno Pharmaceutical Co., Ltd.) as an aqueous sodium hydroxide solution, pH 13.2) to make the pH of the conti...

Embodiment 2

[0109] In addition to using a plating solution of a Sn-Ag-Cu ternary alloy having another composition (the MetasuAM (manufactured by Yuken Industries) is 110 g / l, Sn is 60 g / l, Ag is 3.4 g / l, Cu is 1.2 g / l, inorganic system chelating agent (the described FCM-A, the FCM company system) 15g / l, the organic system chelating agent (the described FCM-B, the FCM company system) is 10g / l, the additive (the described FCM company system) -C, manufactured by FCM Corporation) was 30 cc / l) instead of the electroplating solution of the Sn-Ag-Cu ternary alloy in Example 1, and the others were the same as in Example 1 to obtain the terminal of the present invention.

[0110] The terminals thus obtained were sampled at points 10m and 90m from one end, and the cross-section was cut using a FIB device to measure the thickness. The thickness of the base layer made of Ni was 1.1μm, and that of The thickness of the surface layer composed of Cu ternary alloy was 3.5 μm. Furthermore, the surface la...

Embodiment 3

[0114] In addition to using a plating solution of a Sn-Ag-Cu ternary alloy having another composition (the MetasuAM (manufactured by Yuken Industries) is 110 g / l, Sn is 60 g / l, Ag is 3.8 g / l, Cu is 1.2 g / l, inorganic system chelating agent (the described FCM-A, the FCM company system) 15g / l, the organic system chelating agent (the described FCM-B, the FCM company system) is 10g / l, the additive (the described FCM company system) -C, manufactured by FCM Corporation) was 30 cc / l) instead of the electroplating solution of the Sn-Ag-Cu ternary alloy in Example 1, and the others were the same as in Example 1 to obtain the terminal of the present invention.

[0115] The terminals thus obtained were sampled at points 10m and 90m from one end, and the cross-section was cut using a FIB device to measure the thickness. The thickness of the base layer made of Ni was 1.1μm, and that of The thickness of the surface layer composed of Cu ternary alloy was 3.5 μm. Furthermore, the surface la...

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Abstract

The invention provides a kind of terminal, the surface layer composed of Sn-Ag-Cu ternary alloy is formed by electroplating on the whole or part of the conductive substrate, and the characteristic is that the Sn-Ag-Cu ternary alloy is composed of Sn Containing 70 to 99.8% by mass, Ag containing 0.1 to 15% by mass, and Cu containing 0.1 to 15% by mass, its melting point is 210 to 230°C, and compared with when the surface layer is formed of only Sn, the formation A finer granular crystalline state.

Description

technical field [0001] The present invention relates to terminals (for example, connector terminals, relay terminals, slide switch terminals, soldering terminals, etc.) Terminals that are particularly suitable for applications that require solderability and contact reliability, and components that use such terminals (such as connectors, relays, slide switches, resistors, capacitors, coils, substrates, etc.), and those equipped with them Products (such as semiconductor products, electrical products, electronic products, solar cells, automobiles, etc.). Background technique [0002] In various products such as conductive products, electric products, electronic products, solar cells, and automobiles, methods of conducting electricity include soldering or contacting using terminals made of conductive substrates. [0003] Such terminals, as disclosed in JP-A-1-298617, are generally made of Au, Ag, Pd, Cu, Ni, In, Sn, and Sn-Pb in order to improve solderability or to improve corr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/03
CPCC22C13/00H01R13/03Y10T428/12687Y10T428/12708Y10T428/12715Y10T428/12556
Inventor 三浦茂纪
Owner FCM CO LTD
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