Electronic sealed metal casing powder injecting forming binder formula

Abstract

An adhesive for the powder injection moulding of metal package used for electronic device is prepared from high-density polyethene, stearic acid, paraffin wax, MP-22 and polypropene proportionally. Its advantages are high strength and quality of said metal package, low dosage, no chemical reaction and poison and no pollution.

Description

technical field [0001] The invention relates to a binder in metal powder injection molding technology, in particular to a binder formula for electronic package metal shell powder injection molding. Background technique [0002] With the rapid development of electronic technology, the requirements for the quality and dimensions of electronic packaging shells are getting higher and higher. like figure 1 As shown, it is an electronic packaging shell commonly used in the semiconductor industry. figure 2 It is the application of electronic packaging shells in the semiconductor industry. The most commonly used material is iron-nickel-cobalt alloy (Fe24.9%, Ni29.1%, 50% CoFe 46%). like figure 1 , 2 As shown, its shape is complex, the shape is small (such as length 20.2, width 19.1, height 7.9), the small hole on the side has high precision, and the hole diameter is: Φ1.52 0.00 +0.025 , Φ1.02 0.00 +0.025 , Φ0.46 -0.02 +0.02 . If the part is produced by conventional formi...

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Problems solved by technology

After the test, the thermoplastic system binder is selected, which is prone to volatilization and phase separation during mixing, unstable performance of the injection material, poor shape retention, easy phase separation, low strength of the formed blank, slightly lower loading capacity, slow degreasing, serious It affects the forming of the electronic packaging shell; the thermosetting system is porous and difficult to degrease; the water-soluble system has a narrow injection range and is easy to deform, which is not suitable for high sintering density; the product produced by gel system water has low green strength , easy to deform, narrow injection range

Adhesives in the prior art are not ideal for forming electronic packaging shells

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