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Nano-line silicone carbide metal oxide semiconductor field effect transistor

A technology of oxide semiconductors and field effect transistors, applied in the field of manufacturing new power semiconductor devices, to achieve the effects of not easy heat accumulation, high pressure and high temperature resistance, and reduced manufacturing costs

Inactive Publication Date: 2005-10-26
HUBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

They can both build nanowire transistors

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Example 1. Fabrication of a single nanowire silicon carbide metal oxide semiconductor field effect transistor.

[0011] An example of the present invention is to use nanowire silicon carbide with a diameter of 10nm and a length of 70nm to manufacture a single nanowire silicon carbide metal oxide semiconductor field effect transistor. The nanowire silicon carbide material is silicon carbide nanowire doped with nitrogen, which is separated into a single nanowire state by a dispersion liquid and laid on a semi-insulating substrate of a silicon carbide wafer. A photolithography plate containing two electrodes with a patterned structure of external leads is used. The electrode spacing is 15 nm. Coating photoresist, exposing with ultraviolet light, and then evaporating metal electrodes in a thermal resistance vacuum furnace, the electrode material is palladium metal, forming two source electrodes and drain electrodes. After the electrodes are wired, a silicon oxide film is ...

Embodiment 2

[0012] Example 2 Multi-nanowire silicon carbide metal oxide semiconductor field effect transistor.

[0013] Nitrogen-doped nanowire silicon carbide is arranged in parallel on a silicon carbide wafer semi-insulating substrate. Construction of a Multi-Nanowire Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistor. That is, the metal oxide semiconductor field effect transistor unit contains more than two silicon carbide nanowires. According to the process of Example 1, the multi-nanowire silicon carbide metal oxide semiconductor field effect transistor was constructed. In this example, there are 73 silicon carbide nanowires in the metal oxide semiconductor field effect transistor unit. Device performance: normal operation at a temperature of 600°C. The blocking resistance is 6000V, and the on-state specific resistance is 13μΩcm 2 .

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Abstract

Nm line silicon carbide MOS field effect transistor relates to the manufacturing technology of power semiconductor devices. The silicon carbide MOS field effect transistor is manufactured with nm line silicon carbide combining the ultraviolet exposing technology having the advantages of fire resistance, high voltage resistance, bad environment and low conduction resistance.

Description

technical field [0001] The invention relates to a novel power semiconductor device manufacturing technology. Background technique [0002] The traditional dominant power devices are silicon power semiconductor devices. It is made of silicon material. However, due to the small bandgap width of silicon materials and the fact that silicon is not resistant to high temperatures, silicon power devices will fail when they encounter high temperature applications or high currents, causing serious consequences. Therefore, the additional cooling equipment for silicon devices is very complicated and the operating cost is high. [0003] Silicon carbide is an ideal material for power semiconductor device wafers. Its advantages are: wide band gap, high operating temperature (up to 600°C), good thermal stability, small on-state resistance, good thermal conductivity, extremely small leakage current, and PN junction resistance. High voltage, etc., is conducive to the manufacture of high-fr...

Claims

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Application Information

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IPC IPC(8): H01L29/78
Inventor 张洪涛许辉
Owner HUBEI UNIV OF TECH