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Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened

A technology for printed circuit boards, solder blocking, applied in the secondary treatment of printed circuits, devices for applying liquid to surfaces, coatings, etc. question

Inactive Publication Date: 2005-12-07
阿托特希德国有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This prevents defect-free brazing and, moreover, makes cleaning difficult
[0009] Pores are not guaranteed to be paint-free with current application methods

Method used

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  • Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened
  • Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened
  • Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0036] Printed circuit board: 300×420×1.5mm, according to the FR4 type of NEMA (National Electronics Manufacturing Association), the maximum conductor height is 100 μm, and the conductor width is 150 μm.

[0037] Solder barrier varnish: 100 parts by weight of Probimer 65 Fa.Vantico AG + 5 parts by weight of γ-butyrolactone.

[0038] Roll coating device: RC Fa.Bürkle, rubberization: 100mm, Shore hardness A30, Rz 5μm;

[0039] Nip width: 100μm;

[0040] Wet coating: 50 μm.

[0041] Speed: 2m / min;

[0042] Infrared radiator: the wavelength of the first radiator is 2 μm, and the wavelength of the second radiator is 4 μm;

[0043] Circulating air temperature: 120°C;

[0044] Dryer length: 4m.

[0045] result:

[0046] Dry film thickness: 30μm;

[0047] At a conductor height of 100 μm, edge coverage: 11 μm;

[0048] Pore ​​diameter 300 to 1000 μm: No varnish.

example 2

[0050] Printed circuit board (2): 300×420×1.5mm, according to NEMA FR 4 type, the maximum conductor height is 100μm, and the conductor width is 150μm;

[0051] Solder barrier varnish (1): 125 parts by weight of Rütapox VE3746 contained in 80% by weight in ethylene glycol monomethyl ether, Fa. Bakelite AG; 0.5 parts by weight of 2-ethyl-4-methylimidazole Fa .BASF.

[0052] Viscosity: 9500mPas at 25°C;

[0053] TG after curing for one hour at 160°C: 155°C.

[0054] Roll coating device: RC Fa.Bürtle, rubberization: 100mm;

[0055] Hardness: Shore A30, Rz 5μm;

[0056] Nip width: 100μm;

[0057] Wet coating: 50 μm.

[0058] Speed: 2m / min. Infrared radiator: the wavelength of the first radiator is 2 μm, and the wavelength of the second radiator is 4 μm.

[0059] Circulating air temperature: 120°C;

[0060] Dryer length: 4m;

[0061] Cured at 160°C for 1 hour.

[0062] Coating Results:

[0063] Dry film thickness: 30μm;

[0064] At a conductor height of 100 μm, edge cove...

example 3

[0071] Printed circuit board: 300×420×1.5mm. According to NEMA's FR4 type, the maximum conductor height is 100 μm, and the conductor width is 10 μm.

[0072] Solder barrier varnish: 80.0 parts by weight of EPOSID VP868-2, 70% by weight, Duroplast-Chemie;

[0073] 19.5 parts by weight of HAT 9490 Kresolnovolak, 100% by weight, Fa.Vantico;

[0074] 0.5 parts by weight of 2-ethyl-4-methylimidazole Fa.BASF;

[0075] A total of 100 parts by weight, 75% by weight.

[0076] Viscosity: 7500 mPas at 25°C; TG after curing for 1 hour at 160°C: 150°C.

[0077] Roll coater: RC Fa.Robert Bürkle GmbH Freudenstadt;

[0078] Rubberization: 100mm;

[0079] Hardness: Shore A30, Rz 5μm;

[0080] Nip width: 120μm;

[0081] Wet coating: 50μm;

[0082] Transfer: 42% by volume.

[0083] Speed: 2m / min;

[0084] Infrared radiator: the wavelength of the first radiator is 2 μm, and the wavelength of the second radiator is 4 μm;

[0085] Circulating air temperature: 120°C;

[0086] Dryer lengt...

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Abstract

Disclosed are a method and a device for coating printed boards (1) with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened. The device used for carrying out said method comprises at least one roller-type coating plant (2) with an application roller (4), a dosing roller (5) that embodies a dosing gap along with the application roller (4), a storage container (6) for the solder stop lacquer or galvanoresist, which is disposed above the roller-type coating plant (2), means for conveying the printed boards (7), means for drying the solder stop lacquer (11), and an apparatus (13) for turning the coated printed boards. Said roller-type coating plant (2) is provided with only one coating unit for coating the bottom side of the printed boards.

Description

technical field [0001] The invention relates to a method and a device for coating printed circuit boards with a laser-structureable, heat-curable / hardenable solder resist varnish and a galvanoresist. Background technique [0002] The printed circuit board is coated with a solder barrier varnish, in particular a photosensitive solder barrier varnish, in order to protect the conductors and only expose the holes to be soldered and the pads for the solder tin. Before 1975, screen printing was sufficient, and since then, photosensitive solder resist varnishes have been used. In increasingly complex circuits, the required precision can only be guaranteed by a structured process using light. The lacquer is applied on one side, for example, in the Vorhang casting method. This is described in European Patent Application EP0002040A1. [0003] This coating technique leads to some problems. In particular the coverage of the edges of thin conductors with a height of 10 μm in width an...

Claims

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Application Information

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IPC IPC(8): H05K3/28
Inventor H－J·沙费尔
Owner 阿托特希德国有限公司
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