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Multilayer printed wiring board

A multi-layer printing and circuit board technology, applied in the direction of multi-layer circuit manufacturing, circuits, electrical components, etc., can solve the problems of narrowed insulation interval, poor insulation reliability, etc., to reduce loop inductance, high insulation reliability, and miniaturization. and the effect of preventing power shortage

Active Publication Date: 2006-05-10
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above invention, when producing a core substrate having fine wiring patterns, the insulation interval between the wiring patterns is narrowed, resulting in a printed circuit board with poor insulation reliability.

Method used

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  • Multilayer printed wiring board

Examples

Experimental program
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Effect test

no. 1 Embodiment

[0095] [First Example] Glass epoxy substrate

[0096]First, the structure of a multilayer printed circuit board 10 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 7 . 6 is a cross-sectional view showing the multilayer printed circuit board 10 , and FIG. 7 shows a state in which the IC chip 90 is mounted on the multilayer printed circuit board 10 shown in FIG. 6 and placed on a daughter board 94 . As shown in FIG. 6 , in multilayer printed wiring board 10 , conductive circuit 34 and conductive layer 34P are formed on the front surface of core substrate 30 , and conductive circuit 34 and conductive layer 34E are formed on the back surface thereof. The upper conductor layer 34P is formed as a power supply plane layer, and the lower conductor layer 34E is formed as a ground plane layer. The front and back surfaces of the core substrate 30 are connected by via holes 36 . In addition, the interlayer resin insulating layer 50 ...

no. 1 Embodiment -1

[0104] A. Manufacture of resin film for interlayer resin insulating layer

[0105] Bisphenol A type epoxy resin (455 epoxy equivalents, Epikote 1001 manufactured by (油化シェルエポキシ company)) 29 parts by weight, cresol-novolak type epoxy resin (215 epoxy equivalents, Dainippon Ink Chemical Industry Co., Ltd. 39 parts by weight of Epikuron (Epikuron) N-673), 30 parts by weight of phenol novolac resin (phenolic hydrocarbon group equivalent 120, Dainippon Ink Chemical Industry Co., Ltd. phenate KA-7052) containing a triazine structure, heated and melted while stirring To 20 parts by weight of diethylene glycol ethyl ether acetate and 20 parts by weight of solvent naphtha, 15 parts by weight of terminally epoxidized polybutadiene rubber (Tenarekkusu R-45EPT manufactured by Nagase Chemical Industry Co., Ltd.) and 2 parts by weight were added. - 1.5 parts by weight of pulverized phenyl-4,5-bis(hydroxymethyl)imidazole, 2.5 parts by weight of finely ground silica, and 0.5 parts by weight of...

no. 1 Embodiment -2

[0156] Although it is the same as the first embodiment-1 described with reference to FIG. 6 , it is manufactured as follows.

[0157] Thickness of conductor layer of core substrate: 55 μm

[0158] Thickness of the power supply layer of the core substrate: 55 μm

[0159] Thickness of the conductor layer of the interlayer insulating layer: 15 μm

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Abstract

Disclosed is a package board wherein a malfunction or error occurs even when a high-frequency IC chip, in particular an IC chip of more than 3 GHz is mounted. A conductor layer (34P) having a thickness of 30 mum is formed on a core substrate (30), and a conductor circuit (58) having a thickness of 15 mum is formed on a interlayer resin insulating layer (50). By forming the conductor layer (34P) thick, the volume of the conductor itself is increased, thereby reducing the resistance. In addition, the power supply capacity to the IC chip can be improved by using the conductor layer (34) as a power supply layer.

Description

technical field [0001] The present invention relates to a multi-layer printed circuit board; it is proposed that even if a high-frequency IC chip is installed, especially an IC chip in a high-frequency region of 3 GHz or above 3 GHz does not cause malfunction or error, etc. and can improve Multilayer printed circuit boards for electrical characteristics or reliability. Background technique [0002] In a build-up multilayer printed circuit board that constitutes a package for an IC chip, an interlayer insulating resin is formed on both sides or one side of a core substrate that forms a through hole, and the layers are separated by laser or photoetching. The hole for interlayer conduction for interlayer conduction is used to open and form an interlayer resin insulating layer. On the inner wall of the hole for interlayer conduction and the interlayer resin insulating layer, a conductor layer is formed by plating or the like, and patterned by etching or the like to produce a co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH01L2224/16H01L2924/01019H01L2924/01025H01L2924/01046H01L2924/01078H01L2924/01079H01L2924/014H01L2924/09701H01L2924/14H01L2924/15311H01L2924/15312H01L2924/19105H01L2924/19106H01L2924/3011
Inventor 稻垣靖佐野克幸
Owner IBIDEN CO LTD
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