Multilayer printed wiring board

A multi-layer printing and circuit board technology, applied in the direction of multi-layer circuit manufacturing, circuits, electrical components, etc., can solve the problems of narrowed insulation interval, poor insulation reliability, etc., to reduce loop inductance, high insulation reliability, and miniaturization. and the effect of preventing power shortage
CN1771772AActive Publication Date: 2006-05-10IBIDEN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
IBIDEN CO LTD
Publication Date
2006-05-10

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Abstract

Disclosed is a package board wherein a malfunction or error occurs even when a high-frequency IC chip, in particular an IC chip of more than 3 GHz is mounted. A conductor layer (34P) having a thickness of 30 mum is formed on a core substrate (30), and a conductor circuit (58) having a thickness of 15 mum is formed on a interlayer resin insulating layer (50). By forming the conductor layer (34P) thick, the volume of the conductor itself is increased, thereby reducing the resistance. In addition, the power supply capacity to the IC chip can be improved by using the conductor layer (34) as a power supply layer.
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Description

technical field

[0001] The present invention relates to a multi-layer printed circuit board; it is proposed that even if a high-frequency IC chip is installed, especially an IC chip in a high-frequency region of 3 GHz or above 3 GHz does not cause malfunction or error, etc. and can improve Multilayer printed circuit boards for electrical characteristics or reliability. Background technique

[0002] In a build-up multilayer printed circuit board that constitutes a package for an IC chip, an interlayer insulating resin is formed on both sides or one side of a core substrate that forms a through hole, and the layers are separated by laser or photoetching. The hole for interlayer conduction for interlayer conduction is used to open and form an interlayer resin insulating layer. On the inner wall of the hole for interlayer conduction and the interlayer resin insulating layer, a conductor layer is formed by plating or the like, and patterned by etching or the like to produce a co...

Claims

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